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Renesas Electronics Corporation

Overview

This solution is a combination of the ultra-small and low-power consumption 32-bit RA2E1 MCU and the ZSSC3240 sensor signal conditioner (SCC) kit. It realizes pressure measurement and signal processing through IO-Link communication.

Features

  • 32-bit MCU RA2E1 48MHz with Arm® Cortex®-M23 board supports ultra-small size and low-power consumption, contributing to BOM cost reduction and system miniaturization.
  • ZSSC3240 achieves high accuracy of sensor correction with up to 24-bit A/D converter resolution.
  • Check device information, monitor measurement data, and perform parameter setting from the IO-Link tool on the user’s PC through IO-Link master. Enables the user to control LED ON/OFF based on measurement data to easily evaluate the benefits of IO-Link communication.
  • Contains IO-Link stack developed by TMG, which can be suitable for initial evaluation.
  • Photocoupler, power supply ICs, IO-Link PHY, and other peripheral components are also available from Renesas.

Products in the Design

RZ/N1S
Microprocessors Optimized for Small PLC and HMI; Reduces Peripheral Components and Adaptable for Gateway, Sensor Hub
ZIOL2401
Dual Channel IO-Link HV Line Driver Master Transceiver with Integrated DC/DC Converter
ZSSC3240
High-End 24-Bit Sensor Signal Conditioner with Analog and Digital Output
RA2E2
48MHz Arm Cortex-M23 Ultra-Low Power General-Purpose Microcontroller

Sample & Buy

Evaluation Kit for RA2E1 and ZSSC3240 with Network board

RA2E1-IO-LINK-PRESSURE-SENSOR

Active

Add-on Hardware

Additional boards that work with this platform. Some may be required for full functionality or to evaluate specific features.

ZSSC3240 Sensor Signal Conditioner Evaluation Kit

ZSSC3240KIT Active
Configure, calibrate, and evaluate ZSSC3240 sensor signal conditioning using a modular, USB-connected kit. Supports fast prototyping with real sensors or simulated resistive inputs.
Recommended Documents:

Evaluation Kit for RA2E1 MCU Group

EK-RA2E1 Active
Evaluate the RA2E1 MCU with a compact kit designed for low‑power embedded development. Example projects and built‑in debugging speed up application bring‑up.

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