Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | WAFER |
| Pkg. Code: | DICE |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
Product Attributes
| Lead Count (#) | 0 |
| Carrier Type | Wafer |
| Moisture Sensitivity Level (MSL) | 1 |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Qty. per Reel (#) | 0 |
| Qty. per Carrier (#) | 0 |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | -40 to +125°C |
| Country of Wafer Fabrication | GERMANY |
| Adj. Analog Gain | 3 - 3, 7 - 7, 9 - 9, 14 - 14, 26 - 26, 35 - 35, 52 - 52, 70 - 70, 105 - 105, 140 - 140, 210 - 210, 280 - 280, 420 - 420 |
| Automotive Qual. | Yes |
| Function | Resistive SSC |
| Input Type | Single-bridge |
| Interface | Ratiometric Voltage, ZACwire™, I2C |
| MOQ | 2800 |
| Pkg. Type | WAFER |
| Published | No |
| Qualification Level | Automotive |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Resolution (bits) | 16 |
| Sample Rate Max (KHz) | 7.8 |
| Supply Voltage (V) | 4.5 - 5.5 |
| Tape & Reel | No |
Resources for ZSSC3138
Description
The ZSSC3138 is a member of the ZSSC313x product family of CMOS integrated circuits designed for automotive and industrial sensor applications. All family members are well suited for highly accurate amplification and sensor-specific correction of resistive bridge sensor signals. An internal 16-bit RISC microcontroller running a correction algorithm compensates sensor offset, sensitivity, temperature drift, and non-linearity of the connected sensor element. The required calibration coefficients are stored by the single-pass calibration procedure in an on-chip EEPROM. The ZSSC3138 offers a maximum analog gain of 420 and two offset compensation features. These fit the requirements of ceramic thick-film-based sensor elements as well as strain gauges perfectly. The high amplification in combination with the offset compensation offers the capability to set up ceramic-thick-film-based sensor applications without laser trimming, which leads to better long-term stability.