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CMOS Hex D-Type Flip-Flop

Package Information

CAD Model: View CAD Model
Pkg. Type: SBDIP
Pkg. Code: DAV
Lead Count (#): 16
Pkg. Dimensions (mm): 20.32 x 7.49 x 2.41
Pitch (mm): 2.54

Environmental & Export Classifications

Moisture Sensitivity Level (MSL) Not Applicable
Pb (Lead) Free Exempt
ECCN (US)
HTS (US)

Product Attributes

Pkg. Type SBDIP
Lead Count (#) 16
Carrier Type Tube
Moisture Sensitivity Level (MSL) Not Applicable
Pitch (mm) 2.5
Pkg. Dimensions (mm) 20.3 x 7.5 x 2.41
DLA SMD 5962R9660501VEC
Pb (Lead) Free Exempt
Pb Free Category Gold Plate over compliant Undercoat-e4
MOQ 25
Temp. Range (°C) -55 to +125°C
DSEE (MeV·cm2/mg) 75
Length (mm) 20.3
Qualification Level QML Class V (space)
Rating Space
TID HDR (krad(Si)) 100
TID LDR (krad(Si)) ELDRS free
Thickness (mm) 2.41
Width (mm) 7.5

Description

The CD40174BMS consists of six identical D-Type flip-flops having independent data inputs. The clock and clear inputs are common to all six units. Data is transferred to the Q outputs on the positive-going transition of the clock pulse. All six flip-flops are simultaneously reset by a low level on the CLEAR input. The CD40174BMS is supplied in these 16-lead outline packages: Braze Seal DIP H4T, Frit Seal DIP H1E and Ceramic Flatpack H6W.