Evaluation Kit for ZSSC3240
The ZSSC3240KIT Evaluation Kit provides the hardware needed for configuration, calibration and evaluation of the ZSSC3240 Sensor Signal Conditioner (SSC) IC. The user's...
High-End 24-Bit Sensor Signal Conditioner with Analog and Digital Output
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Overview
Description
The ZSSC3240 is a sensor signal conditioning IC (SSC) for highly accurate amplification, digitization, and sensor-specific correction of resistive sensor signals. The ZSSC3240 is suitable for bridge and half-bridge sensors, as well as external voltage-source element and single-element sensors (e.g., Pt100 and external temperature sensor diodes) powered by an on-chip current source. Digital compensation of the sensor offset, sensitivity, temperature drift, and non-linearity is accomplished via a 26-bit math core running a correction algorithm with calibration coefficients stored in a non-volatile, reprogrammable memory. The programmable, integrated sensor front-end allows optimally applying various sensors for a broad range of applications. The ZSSC3240 provides measurement value readouts and programming capabilities via an I2C, SPI, or one-wire interface (OWI). Three different operation modes allow optimal development of digital, digital-analog, and analog-output smart sensor modules including wake-up on request, continuous-on/fast‑response, and automatic/cyclic sensor measurement operations. Absolute and ratiometric voltage, current-loop, or interrupt analog outputs are supported by the ZSSC3240. The analog output options and digital interface options (for calibration and/or a digital application interface) can be combined.
Features
- Digital communication and calibration interfaces:
- SPI up to 10MHz
- I2C (Standard, Fast, and High-Speed Mode)
- One-wire-interface (OWI), up to 100kBit/s
- Accommodates nearly all resistive bridge sensor types (signal spans from 1mV/V up to 500mV/V)
- Supports different sensor element configurations:
- Resistive bridge or half-bridge
- Resistive divider string
- Voltage source
- On-chip temperature sensor
- External temperature sensing supported, e.g. sensor-bridge as temperature detector, external diode, etc.
- Support for Pt100
- Programmable 16-bit digital-to-analog-converter and output:
- (0V to 1V) or (0V to 5V) absolute voltage output
- VDD-ratiometric voltage output
- 4mA to 20mA current-loop output supported
- 0V to 10V absolute-voltage output supported
- On-chip voltage regulators for sensor supply, and IC operation
- Support for VDD regulation by external JFET
- 24-bit analog-to-digital converter and 26 bits digital-signal-conditioning math core
- Reprogrammable, nonvolatile memory (NVM)
- Programmable measurement scheduler for continuous sensing applications, with optimized balance of
- Energy consumption
- Output update rate
- Sensor-signal-conditioning accuracy
- Self-diagnostic coverage and system safety
- On-chip diagnostics:
- Sensor connection
- Broken-chip-check / chipping-check
- Memory integrity
Applications
Documentation
|
|
Date | |
|---|---|---|
| PDF 1.39 MB | Datasheet | |
| PDF 2.92 MB 日本語 | Overview | |
| PDF 9.38 MB 日本語 | Application Note | |
| PDF 2.56 MB | Manual - Hardware | |
| PDF 642 KB | Technical Brief | |
| PDF 986 KB | Application Note | |
| PDF 526 KB | Manual - Software | |
| PDF 381 KB | Manual - Development Tools | |
| PDF 800 KB | Technical Brief | |
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Design & Development
Sample Code
Boards & Kits
Boards & Kits
Models
ECAD Models
Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on products in the Product Options table. If a symbol or model isn't available, it can be requested directly from the website.
Processing table
Description |
Pkg. Type |
Lead Count (#) |
Temp. Range |
Carrier Type |
Buy / Sample |
|
|---|---|---|---|---|---|---|
| Part Number | ||||||
| 304μm thickness, no inking | WAFER | 0 | -40 to 85°C | Wafer | ||
| 725μm thickness, no inking | WAFER | 0 | -40 to 85°C | Wafer | ||
| 304μm thickness, with inking | WAFER | 0 | -40 to 85°C | Wafer | ||
| 725μm thickness, with inking | WAFER | 0 | -40 to 85°C | Wafer | ||
| 304μm thickness, no inking | WAFER | 0 | -40 to 125°C | Wafer | ||
| 725μm thickness, no inking | WAFER | 0 | -40 to 125°C | Wafer | ||
| 304μm thickness, with inking | WAFER | 0 | -40 to 125°C | Wafer | ||
| 725μm thickness, with inking | WAFER | 0 | -40 to 125°C | Wafer | ||
| 13-inch Reel | VFQFPN | 24 | -40 to 85°C | Reel | ||
| 13-inch Reel | VFQFPN | 24 | -40 to 125°C | Reel | Get Samples, | |
| 7-inch Reel | VFQFPN | 24 | -40 to 125°C | Reel | ||
| 304μm thickness, no inking, pre-configured for current loop | WAFER | 0 | -40 to 125°C | Wafer | ||
| 13-inch Reel, pre-configured for current loop | VFQFPN | 24 | -40 to 125°C | Reel | Get Samples, |
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- Cart icon to the right of the chip icon: Indicates that samples are available for this product
Support
Renesas Samples
Select an orderable part number:
| Orderable Part ID | Sample |
|---|---|
| ZSSC3240CI3R | Availability |
| ZSSC3240CL3R | Availability |
play_circle_filledVideos & Training
IDT Sensor Signal Conditioner (SSC) Evaluation Kit Overview
A brief introduction and overview of IDT's sensor signal conditioner evaluation kits. Evaluation kits generally consist of three parts: a communication interface board, a device board, and a sensor simulator board - all connected together. A sophisticated software GUI accompanies the kit, enabling an engineer to learn how to use the part rapidly, do quick prototyping, and practice calibrations.
Presented by David Grice, applications engineer at IDT. For more information about IDT's sensor signal conditioner products, visit https://www.idt.com/ssc
Video List
News & Blog Posts
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