| CADモデル: | View CAD Model |
| Pkg. Type: | VFQFPN |
| Pkg. Code: | NLG16 |
| Lead Count (#): | 16 |
| Pkg. Dimensions (mm): | 3.0 x 3.0 x 1.0 |
| Pitch (mm): | 0.5 |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
| Lead Count (#) | 16 |
| Carrier Type | Tray |
| Moisture Sensitivity Level (MSL) | 3 |
| Qty. per Reel (#) | 0 |
| Qty. per Carrier (#) | 624 |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | -40 to 85°C |
| Country of Assembly | MALAYSIA |
| Country of Wafer Fabrication | AUSTRIA |
| Additive Phase Jitter Typ RMS (fs) | 90 |
| Additive Phase Jitter Typ RMS (ps) | 0.09 |
| Adjustable Phase | No |
| Channels (#) | 1 |
| Core Voltage (V) | 2.5 |
| Function | Buffer |
| Input Freq (MHz) | 2000 |
| Input Type | LVDS, LVPECL, SSTL |
| Inputs (#) | 1 |
| Length (mm) | 3 |
| MOQ | 624 |
| Output Banks (#) | 1 |
| Output Freq Range (MHz) | 2000 |
| Output Skew (ps) | 25 |
| Output Type | LVDS |
| Output Voltage (V) | 2.5 |
| Outputs (#) | 4 |
| Package Area (mm²) | 9 |
| Pitch (mm) | 0.5 |
| Pkg. Dimensions (mm) | 3.0 x 3.0 x 1.0 |
| Pkg. Type | VFQFPN |
| Price (USD) | $4.57244 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Supply Voltage (V) | 2.5 - 2.5 |
| Tape & Reel | No |
| Thickness (mm) | 1 |
| Width (mm) | 3 |
| 掲載 | No |
The 8S89832I is a high speed 1-to-4 Differential-to-LVDS Fanout Buffer. The 8S89832I is optimized for high speed and very low output skew, making it suitable for use in demanding applications such as SONET, 1 Gigabit and 10 Gigabit Ethernet, and Fibre Channel. The internally terminated differential input and VREF_AC pin allow other differential signal families such as LVPECL, LVDS, and SSTL to be easily interfaced to the input with minimal use of external components. The device also has an output enable pin which may be useful for system test and debug purposes. The 8S89832I is packaged in a small 3mm x 3mm 16-pin VFQFN package which makes it ideal for use in space-constrained applications.