WFG (WLCSP-TCURDL 16)

タイトル	情報
Pkg. Name Name used to describe Renesas packages.	W4X4.16B
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.	WFG
Package Description Descriptive text for this package.	4x4 ARRAY 16 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Package Status	Active
Package Type	WLCSP-TCURDL
クラス	PLASTIC
Package Code The unique identifier of this package.	WFG
カテゴリ	PLASTIC
Lead Count	16
Pb (Lead) Free	Yes
長さ	1.66mm
幅	1.66mm
Thickness 取り付け高さ or 本体高さ (外形図をご参照ください)	0.5mm
Pitch	0.4mm
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5	1.66 x 1.66 x 0.50