WDC (WLCSP-TCURDL 64)

タイトル	情報
Pkg. Name Name used to describe Renesas packages.	W8X8.64
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.	WDC
Package Description Descriptive text for this package.	8x8 Array 64 Balls, 0.5mm Pitch, Wafer Level Chip Scale (ASE), Chung-Li, Taiwan
Package Status	Active
Package Type	WLCSP-TCURDL
クラス	PLASTIC
Package Code The unique identifier of this package.	WDC
カテゴリ	PLASTIC
Lead Count	64
Pb (Lead) Free	Yes
長さ	4.03mm
幅	4.03mm
Thickness 取り付け高さ or 本体高さ (外形図をご参照ください)	0.6mm
Pitch	0.5mm
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5	4.03 x 4.03 x 0.60