| タイトル | 情報 |
|---|---|
| Pkg. Name Name used to describe Renesas packages. | R64.C |
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger. | RNY |
| Package Description Descriptive text for this package. | 64 LD CQFP, SOLDER SEAL WITH BOTTOM HEATSINK |
| Package Status | Active |
| Package Type | CQFP |
| クラス | HERMETIC |
| Package Code The unique identifier of this package. | RNY |
| カテゴリ | HERMETIC |
| Lead Count | 64 |
| Pb (Lead) Free | Yes |
| 長さ | 14.1mm |
| 幅 | 14.1mm |
| Thickness 取り付け高さ or 本体高さ (外形図をご参照ください) | 0mm |
| Pitch | 0.64mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5 | 14.10 x 14.10 x 0.00 |
