Important! Users must read and understand the Handling Guide before opening semiconductor packing containers. Failure to properly handle the packing container increases the risk of system assembly defects and / or serious quality & reliability problems.

Transportation and Storage

  • Having impacts on packing may cause defects in the devices and / or packing. When you transport products, prevent having such impacts as tossing or dropping.
  • Avoid leaving packing materials in a high temperature environment during transportation. Packing containers (trays, tape, magazines, etc.) may warp or discolor under the environment over 40°C.
  • Cardboard boxes may deteriorate in strength and become deformed due to factors in the storage location such as humidity, multilayer stacking, and storage duration. Cardboard boxes should be stored in an environment with room temperature and normal humidity (5–35°C, 45–75% RH) and handled following a first-in, first-out order. Note that the maximum number of cardboard boxes that may be stacked safely differs considerably depending on the storage conditions. The maximum number of layers is therefore not indicated on the carton. It is necessary to manage multilayer stacking of cardboard boxes appropriately to match the storage conditions. Concerning storage precautions, please refer to Semiconductor Reliability Handbook.

Unpacking

  • Open the outer boxes from top side. Otherwise, the inner boxes are flipped.
  • The packing of individual items incorporates anti-static measures. However, sufficient care should reduce the risk of electrostatic damage after the devices are unpacked. Refer to the section of Guarding against Static Electricity.
  • Devices have less protection against damage after removal of the outer packing. They should, therefore, be handled carefully after being removed from their outer boxes. Refer to the section of Guarding against Static Electricity.
  • Avoid using box cutters to open cartons, as they may damage moisture-resistant bags and individual packing containers (trays, tape, magazines, etc.).

Moisture-Resistant Packing

Devices with moisture-resistant packing have instructions on handling after unpacking printed on them and marked "Notes on Moisture-Resistant Packing." These instructions should be followed. Since moisture-resistant bags cannot provide protection if they are punctured or damaged, care should be taken with regard to the following.

  • Moisture-resistant bags can easily be punctured when dropped on the corner from a height of a few centimeters onto a hard surface such as a workbench or concrete floor.
  • Due to the shock-absorbing properties of the cardboard carton, the effects of dropping are less if the devices are packed in their inner and outer boxes than if they are only packed in a moisture-resistant bag. It is therefore recommended that devices be handled while still packed in their inner and outer boxes, as far as possible.
  • The danger of bags puncturing or tearing can be reduced by spreading a conductive mat with cushioning properties on the surface of the workbench.

Packing

See the Semiconductor Reliability Handbook for the handling of each packing containers.

Baking

Surface mount packages' reliability, especially the package containing moisture is affected by thermal stress of reflow soldering. To keep product quality, make sure to follow the instructions provided in the product delivery specifications. If there are no instructions in delivery specifications, refer to the following rules.

  • Please store the packages at the temperature of 5 to 30°C and the relative humidity of 70% or less, and mount within the "MS Level" period (maximum storage life after opening bag) indicated on the inner packaging label. If the inner packaging label does not indicate the "MS Level" period, please perform soldering within 168 hours.
  • Bake the devices according to Renesas Semiconductor Package Mount Manual, if a humidity indicator card is packed and its 30% hygroscope detection part turned lavender (pink), or if the packages have been stored beyond the time limit.

Baking Precautions for Packing Containers

Trays

Trays are available in heatproof and non-heatproof versions. Heatproof trays bear a maximum temperature indication in the form "XXX°C MAX" (e.g., "150°C MAX"), the words "HEAT PROOF" or Chinese character Otherwise, the maximum temperature for heatproof trays is 125°C. In addition, the tray can be assumed by be capable of withstanding a maximum temperature of 125°C for up to 24 hours unless otherwise indicated in the delivery specifications. The following should also be considered.

  • Heatproof trays may nevertheless warp when heated or cooled. To minimize warping, place trays on a flat shelf made of a similar material for heating or cooling. Avoid sudden heating or cooling.
  • The maximum temperature indication is the temperature up to which severe warping will not occur. Nevertheless, there is a danger of lead corrosion due to outgas, etc., when baking at temperatures exceeding 125°C, so baking at such temperatures should be avoided.
  • If baking at temperatures exceeding 125°C is unavoidable, take appropriate measures to ensure safety beforehand.
  • Non-heatproof trays must not be heated. Heating such trays could cause ignition or release of toxic gasses and should therefore be avoided under all circumstances. If baking is performed, heatproof trays should be used instead.

Tape

As tape and reel are not heatproof, do not bake those packing. We recommend storing the devices in drying chamber (30% RH or less) at room temperature, if it seems over the maximum storage life time.

Magazines

Magazines are not heatproof. If baking is needed, transfer the devices to a heatproof container. Never bake devices with magazines, as it may be dangerous.

Special Conditions (Mounting Conditions / MSL)

Some products have mounting conditions and moisture sensitivity level (MSL) symbols on the label.

Mounting conditions (T-L-B)

Mounting conditions are shown in Table 1. Maximum numbers of elements are T: Single element, L: 4 elements, B: 3 elements. Each elements is shown from the left in order, and separated by [,(comma)]. If there is no element, it will be indicated as [-(hyphen)]

Table 1: Mounting Conditions

Symbol Explanation Example
T

Temp

Reflow Peak Temperatures (˚C)

T:260 ⇒ Reflow Peak Temperatures 260˚C

L
  • Life
  • (1st element) Temperature (˚C)
  • (2nd element) Humidity (%RH)
  • (3rd element) Life
    • H: Hour
    • D: Day
    • W: Week
    • Y: Year
  • (4th element) Other storage conditions
    • 10: Less than 10%RH
    • 20: 20%RH or below
    • J: In accordance with J-STD-033

L: 25, 65, 72H ⇒ Temperature: 25˚C

Humidity: 65%RH

Life: 72 hours

Special Notes: none

Note: When Special Notes exist, devices must be mounted within (3) period at (1)/(2) or (4) conditions.

B
  • Bake
  • (1st element) Temperature (˚C)
  • (2nd element) Time (H)
  • (3rd element) Special notes
    • A: Unpack just before soldering
    • B: Heat pin leads only
    • C: Unpack just before programming and bake after programming
    • D: Baking required
    • E: Special baking instructions (40˚C +5˚C /-0˚C, 5%RH, 192 hours) or (125˚C±5˚C, 24 hours)
    • J: In accordance with J-STD-033

B: 125, 10H,- ⇒ Temperature: 125˚C

Time: 10 hours

Special Notes: none

Note: When Special Notes has E or J, (1) and (2) have no conditions and are indicated as [-(hyphen)].

MSL (Moisture Sensitivity Levels)

Storage life after opening is shown in Table 2. It is described in two different labels, (1) In accordance with JEDEC-STD, and (2) Actual figure of storage life.

Table2 Storage life after opening (5 to 30℃/70%RH or less)

Type Level/Symbol Term Example
(1) JEDEC-STD confomity 2 1 years MSL:3 ⇒ 168hours
2a 4 weeks
3 168hours
4 72hours
5 48hours
(2)
  • XXH
  • XXD
  • XXW
  • XXM
  • XXY
  • XX hours
  • XX days
  • XX weeks
  • XX months
  • XX years
MSL:10D ⇒ 10days