The ISL6306 controls microprocessor core voltage regulation by driving up to 4 synchronous-rectified buck channels in parallel. Multiphase buck converter architecture uses interleaved timing to multiply channel ripple frequency and reduce input and output ripple currents. Lower ripple results in fewer components, lower component cost, reduced power dissipation, and smaller implementation area. Microprocessor loads can generate load transients with extremely fast edge rates. The ISL6306 features a high bandwidth control loop and ripple frequencies up to >4MHz to provide optimal response to the transients. today's microprocessors require a tightly regulated output voltage position versus load current (droop). The ISL6306 senses current by utilizing patented techniques to measure the voltage across the on resistance, rDS(ON), of the lower MOSFETs or DCR of the output inductor during the lower MOSFET conduction intervals. Current sensing provides the needed signals for precision droop, channel-current balancing, and overcurrent protection. A programmable internal temperature compensation function is implemented to effectively compensate for the temperature coefficient of the current sense element. A unity gain, differential amplifier is provided for remote voltage sensing. Any potential difference between remote and local grounds can be completely eliminated using the remotesense amplifier. Eliminating ground differences improves regulation and protection accuracy. The threshold-sensitive enable input is available to accurately coordinate the start up of the ISL6306 with any other voltage rail. Dynamic-VID™ technology allows seamless on-the-fly VID changes. The offset pin allows accurate voltage offset settings that are independent of VID setting.

Features

  • Precision Multiphase Core Voltage Regulation
  • Differential Remote Voltage Sensing
  • ±0.5% System Accuracy Over Life, Load, Line and Temperature
  • Adjustable Precision Reference-Voltage Offset
  • Precision rDS(ON) or DCR Current Sensing
  • Accurate Load-Line Programming
  • Accurate Channel-Current Balancing
  • Differential Current Sense
  • Microprocessor Voltage Identification Input
  • Dynamic VID™ Technology
  • 8-Bit VID Input with Selectable VR11 Code and Extended VR10 Code at 6.25mV per Bit
  • 0.5V to 1.6V Operation Range
  • Thermal Monitoring
  • Integrated Programmable Temperature Compensation
  • Threshold-Sensitive Enable Function for Power Sequencing and VTT Enable
  • Overcurrent Protection
  • Overvoltage Protection
  • 2-, 3- or 4-Phase Operation
  • Adjustable Switching Frequency Up to 1MHz Per Phase
  • Package Option
  • QFN Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Product Outline
  • QFN Near Chip Scale Package Footprint; Improves PCB Efficiency, Thinner in Profile
  • Pb-Free (RoHS Compliant)

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ Buy Sample
Active QFN Tube 50
Availability
Active QFN Reel 4000
Availability
Active QFN Reel 1000
Availability

Documentation & Downloads

Title language Type Format File Size Date
Datasheets & Errata
ISL6306 Datasheet Datasheet PDF 1.68 MB
Application Notes & White Papers
Five Easy Steps to Create a Multi-Load Power Solution White Paper PDF 846 KB
AN1681: Grounding Techniques Application Note PDF 509 KB
AN1684: Nonideality of Ground Application Note PDF 397 KB
PCNs & PDNs
PCN15046 - Wafer Fabrication Site Change for Listed Intersil Products - Global Foundry P6 Process transfer to Palm Bay - Phase II Product Change Notice PDF 398 KB
PCN13064 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Carsem (CAS) Ipoh, Malaysia Product Change Notice PDF 151 KB
PCN13025B - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products Product Change Notice PDF 222 KB
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal Product Change Notice PDF 106 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump Product Change Notice PDF 173 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia Product Change Notice PDF 248 KB
Other
ISL6306 4-Phase iSim:PE Model Schematic SXSCH 421 KB
ISL6306 3-Phase iSim:PE Model Schematic SXSCH 373 KB
ISL6306 2-Phase iSim:PE Model Schematic SXSCH 326 KB
PLC18018 - General Q3 Product Life Cycle Notice Product Life Cycle Notice PDF 388 KB

Software & Tool Pages

Title Type Description Company
iSim:PE Offline Simulation Tool Simulator iSim Personal Edition (iSim:PE) speeds the design cycle and reduces risk early in any project, identifying parts that can be used in current as well as next-generation designs. Renesas