Pitch (mm) | |
Lead Count (#) | 0 |
Pkg. Type | WAFER |
Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
Pkg. Code | DICE |
Moisture Sensitivity Level (MSL) | 1 |
Pb (Lead) Free | Yes |
ECCN (US) | EAR99 |
HTS (US) | 8542310001 |
Pkg. Type | WAFER |
Lead Count (#) | 0 |
Carrier Type | Wafer |
Moisture Sensitivity Level (MSL) | 1 |
Description | 304μm thickness with inking, pre-configured for current loop |
Qty. per Reel (#) | 0 |
Pitch (mm) | 0 |
Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
Pb (Lead) Free | Yes |
Pb Free Category | e3 Sn |
Temp. Range | -40 to 125°C |
Country of Wafer Fabrication | Taiwan |
Adj. Analog Gain | 1.32 - 540 |
Automotive Qual. | No |
Function | Resistive SSC |
Input Type | Single-bridge |
Interface | I2C, SPI, Alarm, Ratiometric Voltage, Absolute Voltage, Current Loop, OWI |
Length (mm) | 0 |
MOQ | 11922 |
Qty. per Carrier (#) | 0 |
Resolution (bits) | 24 |
Sample Rate Max (KHz) | 2.91 |
Supply Voltage (V) | 2.7 - 5.5 |
Tape & Reel | No |
Thickness (mm) | 0 |
Width (mm) | 0 |
The ZSSC3241 is a sensor signal conditioning IC (SSC) for highly accurate amplification, digitization, and sensor-specific correction of resistive sensor signals. The ZSSC3241 provides best-in-class sensor-element adaptability, and it is suitable for bridge and half-bridge sensors, as well as external voltage-source element and single-element sensors in multiple configurations. Digital compensation of the sensor offset, sensitivity, temperature drift, and non-linearity is accomplished via a 26-bit math core running a correction algorithm with calibration coefficients stored in a non-volatile, reprogrammable memory. A second, separate compensation for gain and offset, and digital-output independent analog-output correction is supported for optimum adaptability of dual-domain (analog and digital) sensor solutions. The programmable, integrated sensor front-end allows optimally applying various sensors for a broad range of applications.
New functions vs. ZSSC3240