Pitch (mm) | 0.5 |
Lead Count (#) | 176 |
Pkg. Type | LFQFP |
Pkg. Dimensions (mm) | 24 x 24 x 1.7 |
Pkg. Code | pkg_11746 |
Moisture Sensitivity Level (MSL) | 3 |
ECCN (US) | 3A991 |
HTS (US) | 8542.31.0001 |
RoHS (R5F572NDDDFC#30) | EnglishJapanese |
Pb (Lead) Free | Yes |
Longevity | 1999 Jan |
Carrier Type | Tray |
Family Name | RX |
Series Name | RX700 |
Group Name | RX72N |
CPU Architecture | RX |
Main CPU | RXv3 |
Sub CPU | No |
Floating Point Unit | Double/Single |
Bit Length | 32 |
Program Memory (KB) | 2048 |
Data Flash (KB) | 32 |
RAM (KB) | 1024 |
ECC SRAM | Yes |
Lead Count (#) | 176 |
Pkg. Type | LFQFP |
Pitch (mm) | 0.5 |
Pkg. Dimensions (mm) | 24 x 24 x 1.7 |
Number of Supply Voltage(s) (#) | 1 |
Supply Voltage (V) | 2.7 - 3.6 |
I/O Ports | 137 |
DMAC or DTC | DMAC&DTC |
DMA (ch) | 8 |
Temperature Sensor (ch) (#) | 1 |
Power-On Reset | Yes |
Watchdog Timer (ch) | 2 |
External Memory Bus (bit) | 8,16,32 |
DRAM I/F | SDRAM I/F |
3D GPU | No |
Accelerator | Trigonometric Function |
Temp. Range | Ta = -40 to +85°C |
External Interrupt Pins (#) | 16 |
LVD or PVD | Yes |
Operating Freq (Max) (MHz) | 240 |
Operating Freq of Sub CPU (Max) | 0 |
Sub-clock (32.768 kHz) | Yes |
On-chip Oscillator | Yes |
Ethernet speed | 10M/100M |
Ethernet (ch) | 2 |
EtherCat (ch) (#) | 0 |
USB Ports (#) | 1 |
USB FS (host ch/device ch) | ( 1 / 1 ) |
USB HS (host ch/device ch) | ( 0 / 0 ) |
USB SS (host ch/device ch) | ( 0 / 0 ) |
PCI Express (generation and ch) | No |
SCI or UART (ch) | 13 |
SPI (ch) | 16 |
QSPI (ch) | 1 |
OSPI (ch) | 0 |
I2C (#) | 16 |
I3C (ch) | 0 |
CAN (ch) | 3 |
CAN-FD (ch) | 0 |
Wireless | No |
IrDA | No |
LIN (#) | 0 |
SDHI (ch) | 1 |
High Resolution Output Timer | No |
PWM Output (pin#) | 47 |
32-Bit Timer (ch) | 7 |
16-Bit Timer (ch) (#) | 18 |
8-Bit Timer (ch) | 4 |
Standby operable timer | No |
Asynchronous General Purpose Timer / Interval Timer (ch) | 0 |
RTC | Yes |
16-Bit A/D Converter (ch) | 0 |
14-Bit A/D Converter (ch) | 0 |
12-Bit A/D Converter (ch) | 29 |
10-Bit A/D Converter (ch) | 0 |
24-Bit Sigma-Delta A/D Converter (ch) | 0 |
16-Bit D/A Converter (ch) | 0 |
12-Bit D/A Converter (ch) | 2 |
10-Bit D/A Converter (ch) (#) | 0 |
8-Bit D/A Converter (ch) | 0 |
Analog Comparator (ch) | 0 |
OPAMP (ch) (#) | 0 |
PGA (ch) | 0 |
Capacitive Touch Sensing Unit (ch) | 0 |
Graphics LCD Controller | Yes |
MIPI Interfaces (DSI) (ch) | 0 |
MIPI Interfaces (CSI) (ch) | 0 |
Camera I/F (Parallel) | 8-bit |
Image Codec | No |
2D Drawing Engine | Yes |
Segment LCD Controller | No |
SSI (ch) | 2 |
Security & Encryption | Unique ID |
Debug Interface | JTAG/Single-wire Serial |
Moisture Sensitivity Level (MSL) | 3 |
12-Bit Timer (ch) | 0 |
32-Bit High Res Timer (ch) | 0 |
ADC | 12-bit x 29-ch |
Asynchronous General Purpose Timer (ch) | 0 |
Bit Size | 32 |
CPU | RXv3 |
DAC | 12-bit x 2-ch |
DMA | Yes |
DTC (ch) | 0 |
Delta-Sigma A/D Converter | No |
Ethernet | Yes |
Family Name | |
Group Name | |
High-Speed Analog Comparator (ch) | 0 |
Human Machine Interface | Graphics LCD Controller, 2D drawing engine, Camera Interface PDC, Serial sound interface |
Lead Compliant | Yes |
Length (mm) | 24 |
Low-Power Analog Comparator (ch) | 0 |
MIPI Interfaces (DSI/CSI) | 0 |
MOQ | 1 |
Pb (Lead) Free | Yes |
SPI (#) | 16 |
Tape & Reel | No |
Thickness (mm) | 1.7 |
Timer | 8-bit x 4-ch, 16-bit x 18-ch, 32-bit x 7-ch |
UART (#) | 13 |
USB | USB Host||USB Peripheral||USB Ports (ch) x 1||USB Endpoints x 10||USB Isochronous Transfer Support |
USBFS (ch) | 0 |
USBHS (ch) | 0 |
Width (mm) | 24 |
The RX72N Group microcontrollers are equipped with the third-generation RX CPU core, the RXv3 core, and these high-performance products operate at 240MHz. Real-time control and networking of equipment are realized with a single chip with 4MB flash memory capable of read operations at 120MHz, 1MB of SRAM and 182 general-purpose I/O ports. The device also supports high-end HMI functionality for advanced display capability. The device also has complete security capability, vital for industrial and consumer equipment today. The RX72N can also contribute to the miniaturization of the housing and the shortening of the development cycle.