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Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | WAFER |
| Pkg. Code: | DICEW |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Pkg. Type | WAFER |
| Lead Count (#) | 0 |
| Carrier Type | WFP |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | -5 to 95°C |
| Country of Wafer Fabrication | USA |
| Application | 800G and beyond advanced multi-level QAM modulation systems |
| Channels (#) | 4 |
| Data Rate Max (Gbps) | 140 |
| Function | Linear Driver |
| MOQ | 70 |
| Output Type | Differential |
| Output Voltage (V) | 4V |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Price (USD) | $434.341 |
| Published | No |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 0 |
| Tape & Reel | No |
Resources for RRT75474
Description
The RRT75474‑DNT is a low‑power, high‑performance, 128Gbaud quad‑channel linear driver IC. It is designed for 800Gbps and beyond optical integrated transmitter small‑form‑factor (SFF) modules used in metro and long‑haul applications.
The device integrates analog control circuitry and digital control via an serial peripheral interface (SPI), enabling precise, independent drive‑level control, and monitoring. Each driver channel features a 100 Ω differential AC‑coupled input and a 60 Ω differential interface with an open‑collector output stage. The device is suitable for InP based, thin‑film lithium niobate, and silicon photonics Mach–Zehnder modulators.