Pkg. Code | pkg_878 |
Lead Count (#) | 80 |
Pkg. Type | LQFP |
Pkg. Dimensions (mm) | 14 x 14 x 1.7 |
ECCN (US) | 3A991 |
RoHS (R5F2L387ADFA#U1) | EnglishJapanese |
Pb (Lead) Free | Yes |
Moisture Sensitivity Level (MSL) | |
HTS (US) |
Carrier Type | Tray |
DMA | No |
Ethernet | No |
Family Name | R8C |
LVD or PVD | No |
Lead Compliant | Yes |
Lead Count (#) | 80 |
Length (mm) | 14 |
MOQ | 1 |
Pb (Lead) Free | Yes |
Pkg. Dimensions (mm) | 14 x 14 x 1.7 |
Pkg. Type | LQFP |
RTC | No |
Tape & Reel | No |
Thickness (mm) | 1.7 |
Width (mm) | 14 |
This Group is supported only for customers who have already adopted these products. The RL78/L13, RL78/L1C Groups are recommended for new designs.
The R8C/L35M Group, R8C/L36M Group, R8C/L38M Group, and R8C/L3AM Group of single-chip MCUs incorporate the R8C CPU core, which implements a powerful instruction set for a high level of efficiency and supports a 1Mb address space, allowing execution of instructions at high speed. In addition, the CPU core integrates a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, helps reduce the number of system components. These groups have data flash (1KB × 4 blocks) with the background operation (BGO) function.