Package Information
| Pkg. Code | PLSP0020JB-A |
| Lead Count (#) | 20 |
| Pkg. Dimensions (mm) | 4.4x6.5 |
Environmental & Export Classifications
| Pb (Lead) Free | No |
| Moisture Sensitivity Level (MSL) | |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| ADC | 10-bit x 4-ch |
| Bit Size | 16 |
| CAN (ch) | 0 |
| CPU | R8C |
| DMA | No |
| Data Flash (KB) | 2 |
| Ethernet | No |
| Family Name | R8C |
| LVD or PVD | Yes |
| Lead Count (#) | 20 |
| Length (mm) | 6.5 |
| MOQ | 1 |
| Operating Freq (Max) (MHz) | 20 |
| Pb (Lead) Free | No |
| Pkg. Dimensions (mm) | 4.4x6.5 |
| RTC | No |
| Temp. Range | -20 to +85°C |
| Timer | 8-bit x 2-ch, 16-bit x 1-ch |
| Width (mm) | 4.4 |
Description
The R8C/17 Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.
This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 20-pin plastic molded LSSOP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. Furthermore, the data flash ROM (1KB × 2 blocks) is embedded in the R8C/17 group. The difference between the R8C/16 and R8C/17 groups is only the existence of the data flash ROM. Their peripheral functions are the same.