Features
- Dual 800mA, Synchronous Step-down Converters and Dual 300mA, General-purpose LDOs
- Input Voltage Range: DCD1/DCD2: 2.3V to 5.5V, - LDO1/LDO2: 1.5V to 5.5V
- 400kb/s I2C-bus Series Interface Transfers the Control Data Between the Host Controller and the ISL9305
- Adjustable Output Voltage: VODCD1/VODCD2: 0.8V to VIN
- Fixed Output I2C Programmability: At 25mV/Step: 0.825V to 3.6V
- LDO1/LDO2 Output Voltage I2C Programmability at 50mV/Step: 0.9V to 3.6V
- 50μA IQ (Typ) with DCD1/DCD2 in Skip Mode; 20μA IQ (Typ) for each Enabled LDO
- On-the-fly I2C Programming of DC/DC and LDO Output Voltages
- DCD1/DCD2 I2C Programmable Skip Mode Under Light Load or Forced Fixed Switching Frequency PWM Mode
- Small, Thin, 4mmx4mm TQFN Package
Description
The ISL9305 is an integrated mini Power Management IC (mini-PMIC) ideal for applications of powering low-voltage microprocessor or multiple voltage rails with battery as input sources, such as a single Li-ion or Li-Polymer. ISL9305 integrates two high-efficiency 3MHz synchronous step-down converters (DCD1 and DCD2) and two low-input, low-dropout linear regulators (LDO1 and LDO2). The 3MHz PWM switching frequency allows the use of very small external inductors and capacitors. Both step-down converters can enter skip mode under light load conditions to further improve the efficiency and maximize the battery life. For noise sensitive applications, they can also be programmed through I2C interface to operate in forced PWM mode regardless of the load current condition. The I2C interface supports on-the-fly slew rate control of the output voltage from 0. 825V to 3. 6V at 25mV/step size for dynamic power saving. Each step-down converter can supply up to 800mA load current. The default output voltage can be set from 0. 8V to VIN using external feedback resistors on the adjustable version, or the ISL9305 can be ordered in factory pre-set voltage options from 0. 9V to 3. 6V in 50mV step. The ISL9305 also provides two 300mA low dropout (LDO) regulators. The input voltage range is 1. 5V to 5. 5V allowing them to be powered from one of the on-chip step-down converters or directly from the battery. The default LDO power-up output comes with factory pre-set fixed output voltage options between 0. 9V to 3. 3V. The ISL9305 is available in a 4mmx4mm 16 Ld TQFN package.
Applications
- Cellular Phones, Smart Phones
- PDAs, Portable Media Players, Portable Instruments
- Single Li-ion/Li-Polymer Battery-Powered Equipment
- DSP Core Power
| Part Number | Status | Samples | Stock | RoHS | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ISL9305IRTAANLZ-T | Obsolete | N/A | In Stock | RoHS:EN | TQFN | 16# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL9305IRTBCNLZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | TQFN | 16# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL9305IRTBFNCZ-T | Obsolete | N/A | In Stock | RoHS:EN | TQFN | 16# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL9305IRTHWCNYZ-T7A | Obsolete | N/A | In Stock | RoHS:EN | TQFN | 16# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL9305IRTWBNLZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | TQFN | 16# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL9305IRTWCLBZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | TQFN | 16# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL9305IRTWCNLZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | TQFN | 16# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL9305IRTWCNYZ-T | Obsolete | N/A | In Stock | RoHS:EN | TQFN | 16# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL9305IRTWLNCZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | TQFN | 16# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
Filters
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- Product Change NoticePDF 326 KB May 21, 2021
- Product AdvisoryPDF 96 KB PA11079 Aug 12, 2011
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Recommended Documents (1)
Datasheets (1)
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- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Application Notes & White Papers (2)
- Product Change NoticePDF 326 KB May 21, 2021
- Product AdvisoryPDF 96 KB PA11079 Aug 12, 2011
Product Notices (PCN, EOL, etc) (4)
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