Features
- Dual 3A and single 6A switching power supply
- High efficiency, up to 95%
- Input voltage range: 2.85V to 6V
- Output voltage range: 0.8V to 5V
- Internal digital soft-start: 1.5ms
- External synchronization up to 4MHz
- Compact size: 9.0mmx6.5mmx1.83mm
- Peak current limiting and hiccup mode short-circuit protection
- Overcurrent protection
ISL8203M Functional Diagram
Description
The ISL8203M is an integrated step-down power module rated for dual 3A output current or 6A current sharing operation. Optimized for generating low output voltages down to 0. 8V, the ISL8203M is ideal for any low power low voltage applications. The supply voltage range is from 2. 85V to 6V. The two channels are 180° out-of-phase for input RMS current and EMI reduction. Each channel is capable of 3A output current. They can be combined to form a single 6A output in current sharing mode. While in current sharing mode, the interleaving of the two channels reduces input and output voltage ripple. The ISL8203M offers an independent Power-Good (PG) signal for each channel. When shut down, the ISL8203M discharges the output capacitor. Other features include internal digital soft-start, enable for power sequence, overcurrent protection and over-temperature protection. The ISL8203M integrates a PWM controller, synchronous switching MOSFETs, inductors and passive components to maximize efficiency and minimize external component count. The ISL8203M is available in a thermally-enhanced, compact QFN package.
Applications
- µC/µP, FPGA and DSP power
- Plug-in DC/DC modules for routers and switchers
- Test and measurement systems
- Bar code reader
| Part Number | Status | Samples | Longevity | Stock | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ISL8203MIRZ | Obsolete | N/A | 2033 Dec | Out of Stock | Module | 23# | Tray | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL8203MIRZ-T | Obsolete | N/A | 2033 Dec | Out of Stock | Module | 23# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL8203MIRZ-T7A | Obsolete | N/A | 2033 Dec | In Stock | Module | 23# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
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- Model - iSim
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
- DocumentPDF 980 KB tb488 Jul 10, 2002
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- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
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