Features
- Complete switch mode power supply in one package
- Patented current share architecture reduces layout sensitivity when modules are paralleled
- Programmable phase shift (1- to 6-phase)
- Extremely low profile (2.2mm height)
- Input voltage range +4.5V to +20V at 10A, current share up to 60A
- A single resistor sets VOUT from +0.6V to +6V
- Output overvoltage, overcurrent and over-temperature protection and undervoltage indication
- RoHS compliant
ISL8200M Functional Diagram
Description
Support is limited to customers who have already adopted these products.
The ISL8200M is a simple and easy to use high power, current-sharing DC\DC power module for Datacom\Telecom\ FPGA power hungry applications. All that is needed is the ISL8200M, a few passive components and one VOUT setting resistor to have a complete 10A design ready for market. The ease of use virtually eliminates the design and manufacturing risks while dramatically improving time to market. Need more output current? Parallel up to six ISL8200M modules to scale up to a 60A solution (see Figure 6 on page 10). The simplicity of the ISL8200M is in its Off The Shelf, unassisted implementation versus a discrete implementation. Patented current sharing in multi-phase operation greatly reduces ripple currents, BOM cost and complexity. For example, parallel 2 for 20A and up to 6 for 60A. The output voltage can be precisely regulated to as low as 0. 6V with ±1% output voltage regulation over line, load, and temperature variations. The ISL8200M’s thermally enhanced, compact QFN package, operates at full load and over temperature, without requiring forced air cooling. It's so thin it can even fit on the back side of the PCB. Easy access to all pins with few external components, reduces the PCB design to a component layer and a simple ground layer.
Applications
- Servers, Telecom and Datacom Applications
- Industrial and Medical Equipment
- Point of Load Regulation
| Part Number | Status | Samples | Stock | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) |
|---|---|---|---|---|---|---|---|---|---|---|
| ISL8200MIRZ | Obsolete | N/A | Out of Stock | Module | 23# | Tray | 3 | _none | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
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- PCB Design FilesZIP 1022 KB isl8200meval2phz Nov 17, 2017
- PCB Design FilesZIP 1.09 MB isl8200m_single_phase_schematic_and_layout Nov 17, 2017
- PCB Design FilesZIP 955 KB isl8200meval1phz_reva_artwork_gerber Nov 17, 2017
- PCB Design FilesZIP 251 KB isl8200meval2phz_reva_artwork Nov 17, 2017
- Product Change NoticePDF 657 KB PCN15031 Jun 08, 2015
- Product Change NoticePDF 98 KB PCN14057 Nov 26, 2014
- Application NotePDF 341 KB an1786 Aug 31, 2012AI-generated Summary: Reducing the switching frequency of power modules increases output ripple current and voltage, potentially causing early overcurrent protection trips and inductor saturation. The ripple current and voltage depend on inductor value, switching frequency, and output capacitor ESR. Lowering frequency may cause loop instability due to fixed compensation, especially with low output capacitance or high ESR. It is recommended not to reduce switching frequency below 500kHz to maintain stability.
- Product Change NoticePDF 102 KB PCN12066 Aug 08, 2012
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
- Manual - Development ToolsPDF 784 KB an1544 Feb 25, 2015
Recommended Documents (1)
Datasheets (1)
- Manual - Development ToolsPDF 784 KB an1544 Feb 25, 2015
Manuals & Guides (3)
- Application NotePDF 341 KB an1786 Aug 31, 2012AI-generated Summary: Reducing the switching frequency of power modules increases output ripple current and voltage, potentially causing early overcurrent protection trips and inductor saturation. The ripple current and voltage depend on inductor value, switching frequency, and output capacitor ESR. Lowering frequency may cause loop instability due to fixed compensation, especially with low output capacitance or high ESR. It is recommended not to reduce switching frequency below 500kHz to maintain stability.
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Application Notes & White Papers (3)
- Product Change NoticePDF 657 KB PCN15031 Jun 08, 2015
- Product Change NoticePDF 98 KB PCN14057 Nov 26, 2014
- Product Change NoticePDF 102 KB PCN12066 Aug 08, 2012
Product Notices (PCN, EOL, etc) (4)
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- PCB Design FilesZIP 1022 KB isl8200meval2phz Nov 17, 2017
- PCB Design FilesZIP 1.09 MB isl8200m_single_phase_schematic_and_layout Nov 17, 2017
- PCB Design FilesZIP 955 KB isl8200meval1phz_reva_artwork_gerber Nov 17, 2017
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- PCB Design FilesZIP 955 KB isl8200meval1phz_reva_artwork_gerber Nov 17, 2017
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