Features
- Electrically screened to SMD # 5962-07218
- QML qualified per MIL-PRF-38535 requirements
- Radiation tolerance
- High dose rate (50-300rad(Si)/s): 100krad(Si)
- Low dose rate (0.01rad(Si)/s): 50krad(Si)*
- SEL immune: Bonded wafer dielectric isolation
- NPN gain bandwidth product (FT: 8GHz (typ)
- NPN current gain (hFE): 130 (typ)
- NPN early voltage (VA): 50V (typ)
- PNP gain bandwidth product (FT): 5.5GHz (typ)
- PNP current gain (hFE): 60 (typ)
- PNP early voltage (VA): 20V (typ)
- Noise figure (50Ω) at 1GHz: 3.5dB (typ)
- Collector-to-collector leakage: <1pA (typ)
- Complete isolation between transistors * Limit established by characterization
Description
The ISL73096, ISL73127 and ISL73128 are radiation hardened bipolar transistor arrays. The ISL73096 consists of three NPN transistors and two PNP transistors on a common substrate. The ISL73127 consists of five NPN transistors on a common substrate. The ISL73128 consists of five PNP transistors on a common substrate. The ISL73096EH, ISL73127EH and ISL73128EH devices encompass all of the production testing of the ISL73096RH, ISL73127RH and ISL73128RH devices and additionally are tested in the Intersil Enhanced Low Dose Rate Sensitivity (ELDERS) product manufacturing flow. One of our bonded wafer, dielectrically isolated fabrication processes provides an immunity to single event latch-up and the capability of highly reliable performance in a radiation environment. The high gain-bandwidth product and low noise figure of these transistors make them ideal for use in high frequency amplifier and mixer applications. Monolithic construction of the NPN and PNP transistors provides the closest electrical and thermal matching possible. Access is provided to each terminal of the transistors for maximum application flexibility.
Parameters
| Attributes | Value |
|---|---|
| Rating | Space |
| NPN Transistors (#) | 3 |
| PNP Transistors (#) | 2 |
| Temp. Range (°C) | -40 to +85°C, -55 to +125°C |
| TID HDR (krad(Si)) | 100, 300 |
| DSEE (MeV·cm2/mg) | SEL free |
| Flow | RH Hermetic |
| Qualification Level | Class V, EM |
| Die Sale Availability? | Yes |
| PROTO Availability? | Yes |
Applications
- High frequency amplifiers and mixers
- High frequency converters
- Synchronous detector
| Part Number | Status | Samples | Stock | RoHS | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | TID HDR (krad(Si)) | DLA SMD | Pb (Lead) Free | Pb Free Category | MOQ | Temp. Range (°C) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ISL73096RHF/PROTO | Active | Available | In Stock | Contact | CFP | 16# | Tray | Not Applicable | 100 | Exempt | Gold Plate over compliant Undercoat-e4 | 1 | -55 to +125°C | |
| ISL73096RHVF | Active | N/A | In Stock | Contact | CFP | 16# | Tray | Not Applicable | 100 | 5962F0721801VXC | Exempt | Gold Plate over compliant Undercoat-e4 | 25 | -55 to +125°C |
| ISL73096RHVX | Active | N/A | Out of Stock | RoHS:EN RoHS:JA | DIE | 100 | 5962F0721801V9A | No | 100 | -55 to +125°C | ||||
| ISL73096RHX/SAMPLE | Active | N/A | Out of Stock | Contact | DIE | 300 | No | 5 | -40 to +85°C |
Filters
Applied Filters
- Price Increase NoticePDF 360 KB PIN19011 Apr 10, 2019
- Product AdvisoryPDF 83 KB PA14004 Jan 30, 2014
- Product AdvisoryPDF 499 KB PA11003 Jan 05, 2011
- Product Change NoticePDF 230 KB PCN10123 Dec 06, 2010
- Application NotePDF 256 KB an1503 Jan 19, 2004AI-generated Summary: The document details the design of high-gain low-noise and wideband RF amplifiers using specific transistor arrays. It emphasizes minimizing conductor length in RF paths to maintain impedance and highlights component evaluation with network analyzers. The wideband amplifier achieves 10dB flat gain over 600MHz bandwidth with stable biasing using PNP transistors. The high-gain amplifier offers over 17dB gain at 900MHz with a 3.9dB noise figure. Microstrip board layouts and measured performance characteristics are provided.
- Application NotePDF 338 KB an9867 Nov 10, 1999AI-generated Summary: Electrical parameters are monitored during life testing to detect drift and failures, defined by exceeding datasheet limits. New products require less than 1% failure during burn-in, with failure analysis and corrective actions if exceeded. Sampling plans ensure defect rates below 3%. Life tests last 1000-3000 hours at 125°C depending on process maturity. Failure mechanisms include electromigration, ionic contamination, hot carrier injection, and dielectric rupture. Product sign-off requires all parties' approval after reliability confirmation. Space products undergo burn-in and quality conformance inspections with strict failure limits. Derating is unnecessary as datasheet limits are set at 6-sigma from characterization data, ensuring reliability.
- DatasheetPDF 469 KB isl73096rh-127rh-128rh-096eh-127eh-128eh Jul 27, 1999
- Application NotePDF 224 KB an9654 May 05, 1999AI-generated Summary: The document explains the reliability and failure mechanisms of semiconductor parts, focusing on life testing and wearout. It discusses how switching states cause transient current pulses and hot carrier injection, which only occur briefly during switching. Life testing at elevated temperatures accelerates aging to remove infant mortality failures, improving reliability. The failure rate follows a bathtub curve with infant mortality, useful life, and wearout phases, modeled by lognormal and exponential distributions. The Arrhenius equation relates failure rates at different temperatures. Burn-in and life tests reduce early failures without harming intrinsic reliability.
- DatasheetPDF 469 KB isl73096rh-127rh-128rh-096eh-127eh-128eh Jul 27, 1999
Recommended Documents (1)
- DatasheetPDF 469 KB isl73096rh-127rh-128rh-096eh-127eh-128eh Jul 27, 1999
Datasheets (1)
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- Application NotePDF 256 KB an1503 Jan 19, 2004AI-generated Summary: The document details the design of high-gain low-noise and wideband RF amplifiers using specific transistor arrays. It emphasizes minimizing conductor length in RF paths to maintain impedance and highlights component evaluation with network analyzers. The wideband amplifier achieves 10dB flat gain over 600MHz bandwidth with stable biasing using PNP transistors. The high-gain amplifier offers over 17dB gain at 900MHz with a 3.9dB noise figure. Microstrip board layouts and measured performance characteristics are provided.
- Application NotePDF 338 KB an9867 Nov 10, 1999AI-generated Summary: Electrical parameters are monitored during life testing to detect drift and failures, defined by exceeding datasheet limits. New products require less than 1% failure during burn-in, with failure analysis and corrective actions if exceeded. Sampling plans ensure defect rates below 3%. Life tests last 1000-3000 hours at 125°C depending on process maturity. Failure mechanisms include electromigration, ionic contamination, hot carrier injection, and dielectric rupture. Product sign-off requires all parties' approval after reliability confirmation. Space products undergo burn-in and quality conformance inspections with strict failure limits. Derating is unnecessary as datasheet limits are set at 6-sigma from characterization data, ensuring reliability.
- Application NotePDF 224 KB an9654 May 05, 1999AI-generated Summary: The document explains the reliability and failure mechanisms of semiconductor parts, focusing on life testing and wearout. It discusses how switching states cause transient current pulses and hot carrier injection, which only occur briefly during switching. Life testing at elevated temperatures accelerates aging to remove infant mortality failures, improving reliability. The failure rate follows a bathtub curve with infant mortality, useful life, and wearout phases, modeled by lognormal and exponential distributions. The Arrhenius equation relates failure rates at different temperatures. Burn-in and life tests reduce early failures without harming intrinsic reliability.
Application Notes & White Papers (3)
- Price Increase NoticePDF 360 KB PIN19011 Apr 10, 2019
- Product AdvisoryPDF 83 KB PA14004 Jan 30, 2014
- Product AdvisoryPDF 499 KB PA11003 Jan 05, 2011
- Product Change NoticePDF 230 KB PCN10123 Dec 06, 2010
Product Notices (PCN, EOL, etc) (4)
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Other (2)
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Knowledge Base
-
ISL73096 Unused Transistors
It is best to connect all unused transistor pins to ground. This prevents open pins from acting as antenna. Also, connecting base and emitter together prevents any transistor from turning on.
Aug 2, 2023