Features
- Supports AMD SVI 2.0 Serial Data Bus Interface
- Dual Output Controller with Integrated Drivers
- Two Dedicated Core Drivers
- One Programmable Driver for Either Core or Northbridge
- Precision Voltage Regulation
- 0.5% System Accuracy Over-Temperature
- 0.5V to 1.55V in 6.25mV Steps
- Enhanced Load Line Accuracy
- Supports Multiple Current Sensing Methods
- Lossless Inductor DCR Current Sensing
- Precision Resistor Current Sensing
- Programmable 1-, 2- or 3-Phase for the Core Output and 1- or 2-Phase for the Northbridge Output
- Adaptive Body Diode Conduction Time Reduction
- Superior Noise Immunity and Transient Response
- Output Current Monitor and Thermal Monitor
- Differential Remote Voltage Sensing
- High Efficiency Across Entire Load Range
- Programmable Slew Rate
- Programmable VID Offset and Droop on Both Outputs
- Programmable Switching Frequency for Both Outputs
- Excellent Dynamic Current Balance Between Phases
- OCP/WOC, OVP, PGOOD, and Thermal Monitor
- Small Footprint 48 Ld 6x6 QFN Package
- Pb-Free (RoHS Compliant)
Description
The ISL6277 is fully compliant with AMD Fusion™ SVI 2. 0 and provides a complete solution for microprocessor and graphics processor core power. The ISL6277 controller supports two Voltage Regulators (VRs) with three integrated gate drivers and two optional external drivers for maximum flexibility. The Core VR can be configured for 3-, 2-, or 1-phase operation while the Northbridge VR supports 2- or 1-phase configurations. The two VRs share a serial control bus to communicate with the AMD CPU and achieve lower cost and smaller board area compared with two-chip solutions. The PWM modulator is based on Intersil’s Robust Ripple Regulator R3 Technology™. Compared to traditional modulators, the R3 modulator can automatically change switching frequency for faster transient settling time during load transients and improved light load efficiency. The ISL6277 has several other key features. Both outputs support DCR current sensing with single NTC thermistor for DCR temperature compensation or accurate resistor current sensing. Both outputs utilize remote voltage sense, adjustable switching frequency, OC protection and power good.
Applications
- AMD Fusion CPU/GPU Core Power
- Notebook Computers
| Part Number | Status | Samples | Stock | RoHS | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ISL6277HRZ | Obsolete | N/A | Out of Stock | RoHS:EN | QFN | 48# | Tube | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -10 to +100°C |
| ISL6277HRZ-T | Obsolete | N/A | In Stock | RoHS:EN | QFN | 48# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -10 to +100°C |
| ISL6277IRZ | Obsolete | N/A | Out of Stock | RoHS:EN | QFN | 48# | Tube | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
| ISL6277IRZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | QFN | 48# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C |
Filters
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- Product Change NoticePDF 326 KB May 21, 2021
- Product Change NoticePDF 223 KB PCN13060 Oct 30, 2013
- Product Change NoticePDF 183 KB PCN13024 Mar 07, 2013
- Product Change NoticePDF 82 KB PCN12056 Jul 10, 2012
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Recommended Documents (1)
Datasheets (1)
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- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Application Notes & White Papers (2)
- Product Change NoticePDF 326 KB May 21, 2021
- Product Change NoticePDF 223 KB PCN13060 Oct 30, 2013
- Product Change NoticePDF 183 KB PCN13024 Mar 07, 2013
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Product Notices (PCN, EOL, etc) (6)
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