Package Information
| Lead Count (#) | 80 |
| Pkg. Code | pkg_837 |
| Pkg. Type | LQFP |
| Pkg. Dimensions (mm) | 14 x 14 x 1.7 |
Environmental & Export Classifications
| ECCN (US) | 3A991 |
| HTS (US) | 85423190000 |
| RoHS (R4F20223NFD#U0) | EnglishJapanese |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
Product Attributes
| CPU | H8S/2000 |
| Bit Size | 16 |
| RAM (KB) | 8 |
| Program Memory (KB) | 128 |
| Data Flash (KB) | 8 |
| Lead Count (#) | 80 |
| Operating Freq (Max) (MHz) | 20 |
| Timer | 8-bit x 3-ch, 16-bit x 5-ch |
| ADC | 10-bit x 16-ch |
| DAC | 8-bit x 2-ch |
| RTC | Yes |
| LVD or PVD | Yes |
| DMA | No |
| Ethernet | No |
| Temp. Range | -20 to +85°C |
| Country of Assembly | China |
| Country of Wafer Fabrication | Japan |
| Price (USD) | 1ku | 9.03039 |
| Carrier Type | Tray |
| Family Name | H8S |
| Lead Compliant | Yes |
| Length (mm) | 14 |
| MOQ | 1 |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 14 x 14 x 1.7 |
| Pkg. Type | LQFP |
| Tape & Reel | No |
| Thickness (mm) | 1.7 |
| Width (mm) | 14 |
Description
The H8S/20235, 20223 Group is supported only for customers who have already adopted these products. The RX130, RX230, RL78/G14, RL78/I1C Groups are recommended.