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512K x 9 SuperSync FIFO, 3.3V

Package Information

Lead Count (#) 64
Pkg. Code PNG64
Pitch (mm) 0.8
Pkg. Type TQFP
Pkg. Dimensions (mm) 14.0 x 14.0 x 1.4

Environmental & Export Classifications

Pb (Lead) Free Yes
Moisture Sensitivity Level (MSL) 3
ECCN (US) NLR
HTS (US) 8542320071

Product Attributes

Lead Count (#) 64
Pb (Lead) Free Yes
Carrier Type Tray
Moisture Sensitivity Level (MSL) 3
Country of Assembly Taiwan
Country of Wafer Fabrication Taiwan, United States
Price (USD) | 1ku 180.782
Architecture Uni-directional
Bus Width (bits) 9
Core Voltage (V) 3.3
Density (Kb) 4096
Family Name SuperSync
I/O Frequency (MHz) 1 - 1
I/O Type 3.3 V LVTTL
Interface Synchronous
Length (mm) 14
MOQ 45
Organization 512K x 9
Package Area (mm²) 196.0
Pb Free Category e3 Sn
Pitch (mm) 0.8
Pkg. Dimensions (mm) 14.0 x 14.0 x 1.4
Pkg. Type TQFP
Qty. per Carrier (#) 90
Qty. per Reel (#) 0
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel No
Temp. Range 0 to 70°C
Thickness (mm) 1.4
Width (mm) 14

Description

The 72V2111 is a 16K x 9 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, Read Clock (RCLK) or Write Clock (WCLK), is running at the higher frequency. The period required by the retransmit operation and the first word data latency period is now fixed and short; the variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated on this SuperSync family.