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256K x 18 SuperSync FIFO, 3.3V

Package Information

CAD Model:View CAD Model
Pkg. Type:TQFP
Pkg. Code:PNG64
Lead Count (#):64
Pkg. Dimensions (mm):14.0 x 14.0 x 1.4
Pitch (mm):0.8

Environmental & Export Classifications

Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)3
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#)64
Pb (Lead) FreeYes
Carrier TypeReel
Moisture Sensitivity Level (MSL)3
ArchitectureUni-directional
Bus Width (bits)18
Core Voltage (V)3.3
Density (Kb)4096
Family NameSuperSync
I/O Frequency (MHz)66 - 66
I/O Type3.3 V LVTTL
InterfaceSynchronous
Length (mm)14
MOQ750
Organization256K x 18
Package Area (mm²)196
Pb Free Categorye3 Sn
Pitch (mm)0.8
Pkg. Dimensions (mm)14.0 x 14.0 x 1.4
Pkg. TypeTQFP
Price (USD)$158.65863
PublishedNo
Qty. per Carrier (#)0
Qty. per Reel (#)750
Reel Size (in)13
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelYes
Temp. Range (°C)-40 to 85°C
Thickness (mm)1.4
Width (mm)14

Description

The 72V2105 is an 256K x 18 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. SuperSync FIFOs are particularly appropriate for networking, video, telecommunications, data communications and other applications that need to buffer large amounts of data.