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256K x 9 SuperSync FIFO, 3.3V

Package Information

CAD Model:View CAD Model
Pkg. Type:TQFP
Pkg. Code:PNG64
Lead Count (#):64
Pkg. Dimensions (mm):14.0 x 14.0 x 1.4
Pitch (mm):0.8

Environmental & Export Classifications

Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)3
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#)64
Pb (Lead) FreeYes
Carrier TypeTray
ArchitectureUni-directional
Bus Width (bits)9
Core Voltage (V)3.3
Density (Kb)2048
Family NameSuperSync
I/O Frequency (MHz)100 - 100
I/O Type3.3 V LVTTL
InterfaceSynchronous
Length (mm)14
MOQ45
Moisture Sensitivity Level (MSL)3
Organization256K x 9
Package Area (mm²)196
Pb Free Categorye3 Sn
Pitch (mm)0.8
Pkg. Dimensions (mm)14.0 x 14.0 x 1.4
Pkg. TypeTQFP
Price (USD)$132.32956
PublishedNo
Qty. per Carrier (#)90
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)0 to 70°C
Thickness (mm)1.4
Width (mm)14

Description

The 72V2101 is a 256K x 9 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. The period required by the retransmit operation and the first word data latency period is now fixed and short. (The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated on this SuperSync family.)