Renesas Blog

Read about three ways the Renesas FSP will lighten your workload as you build your next secure, connected IoT devices.

Artificial intelligence (AI) at the edge of the network is a cornerstone that will influence the future direction of technology. If AI is an engine of change, semiconductors are the oil driving the new age.

Renesas Ready Partner Network solutions deliver plug-and-play options to help simplify the design process and accelerate both time to market and time to revenue across the extensive Renesas MPU and MCU platforms.

In this blog, the RH850 Virtual Platform (VPF) function to improve the safety and quality of automotive software is introduced.

We are introducing an Application Note and sample programs as reference for implementing QSPI serial Flash XIP functionality on the RX671.

Instead of custom boards that are difficult to develop, Tomoyuki introduces the RZ-based SoMs and SBCs enabling high-performance HMI development with minimal costs and resources, in a shorter time. 

This blog provides an overview of LoRa® and LoRaWAN® communications suitable for IoT and the LoRa-based solutions with low power and easy to design/evaluate features that are available from Renesas.

Introduces the concept of the Data Operating Circuit (DOC) and how it can be used to control smart peripherals without CPU intervention, so improving system determinism and reducing power consumption.

We will introduce a multi-device synchronous debug & trace tool (released in September 2022) that enables synchronized execution, break control, and acquisition of trace information for multiple SoCs and MCUs.

We introduce the RA6T2 evaluation environment that enables immediate evaluation of motors with inductive position sensor IC (IPS2200), and the advantages of inductive position sensor ICs.