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Complete Current Share 10A DC/DC Power Module

Package Information

CAD Model:View CAD Model
Pkg. Type:Module
Pkg. Code:YGE
Lead Count (#):23
Pkg. Dimensions (mm):15.0 x 15.0 x 2.20
Pitch (mm):1.1

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeExempt
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#)23
Carrier TypeTray
Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeExempt
Pb Free CategoryPb-Free 100% Matte Tin Plate w/Anneal-e3
Temp. Range (°C)-40 to +85°C
ConfigurationNormal
Control TypeVoltage Mode
Current SharingYes
Digital BusNo
Input Voltage (Max) (V)20
Input Voltage (Min) (V)4.5
Length (mm)15
MOQ96
Output Current (Max) [Rail 1] (A)10
Output Voltage (Max) (V)6
Output Voltage (Min) (V)0.6
PORYes
Parametric CategoryAnalog-Interface Power Modules
Peak Efficiency (%)94
Pitch (mm)1.1
Pkg. Dimensions (mm)15.0 x 15.0 x 2.20
Pkg. TypeModule
Pvin (Max)20
Pvin (Min)3
Qualification LevelStandard
Quiescent Current36 mA
SYNCH CapabilityYes
Simulation Model AvailableiSim
Switching Frequency (KHz)1.5 - 1.5
Switching Frequency Range (Typical) (kHz)700 - 1500
Thickness (mm)2.2
Width (mm)15

Description

Support is limited to customers who have already adopted these products.

The ISL8200M is a simple and easy to use high power, current-sharing DC\DC power module for Datacom\Telecom\ FPGA power hungry applications. All that is needed is the ISL8200M, a few passive components and one VOUT setting resistor to have a complete 10A design ready for market. The ease of use virtually eliminates the design and manufacturing risks while dramatically improving time to market. Need more output current? Parallel up to six ISL8200M modules to scale up to a 60A solution (see Figure 6 on page 10). The simplicity of the ISL8200M is in its Off The Shelf, unassisted implementation versus a discrete implementation. Patented current sharing in multi-phase operation greatly reduces ripple currents, BOM cost and complexity. For example, parallel 2 for 20A and up to 6 for 60A. The output voltage can be precisely regulated to as low as 0. 6V with ±1% output voltage regulation over line, load, and temperature variations. The ISL8200M’s thermally enhanced, compact QFN package, operates at full load and over temperature, without requiring forced air cooling. It's so thin it can even fit on the back side of the PCB. Easy access to all pins with few external components, reduces the PCB design to a component layer and a simple ground layer.