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FemtoClock SAS/SATA Clock Generator

Package Information

CAD Model: View CAD Model
Pkg. Type: SOIC
Pkg. Code: DCG8
Lead Count (#): 8
Pkg. Dimensions (mm): 4.9 x 3.9 x 1.5
Pitch (mm): 1.27

Environmental & Export Classifications

Moisture Sensitivity Level (MSL) 1
Pb (Lead) Free Yes
ECCN (US) EAR99
HTS (US) 8542.39.0090

Product Attributes

Lead Count (#) 8
Carrier Type Reel
Moisture Sensitivity Level (MSL) 1
Output Freq Range (MHz) 150 - 150
Qty. per Reel (#) 3000
Qty. per Carrier (#) 0
Pb (Lead) Free Yes
Pb Free Category e3 Sn
Temp. Range (°C) 0 to 70°C
Advanced Features Spread Spectrum
Core Voltage (V) 2.5V, 3.3V
Feedback Input No
Input Freq (MHz) 25 - 25
Input Type Crystal
Inputs (#) 1
Length (mm) 4.9
MOQ 3000
Output Banks (#) 1
Output Type LVPECL
Output Voltage (V) 2.5V, 3.3V
Outputs (#) 1
Package Area (mm²) 19.1
Phase Jitter Typ RMS (ps) 0.64
Pitch (mm) 1.27
Pkg. Dimensions (mm) 4.9 x 3.9 x 1.5
Pkg. Type SOIC
Prog. Clock No
Published No
Reel Size (in) 13
Reference Output No
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Spread Spectrum Yes
Tape & Reel Yes
Thickness (mm) 1.5
Width (mm) 3.9

Description

The 843241 is a low jitter, high performance clock generator and a member of the FemtoClock® family of silicon timing products. The 843241 is designed for use in the SAS-2 interconnect and the three transport protocols that use the SAS-2 interconnect: Serial SCSI Protocol (SSP), Serial ATA Tunneled Protocol (STP), and Serial Management Protocol (SMP). The 843241 has excellent (<1ps) RMS phase jitter, over the SAS defined integration range. The 843241 uses an external, 25MHz, parallel resonant crystal to generate three selectable output frequencies: 75MHz, 100MHz, 150MHz, and 300MHz. This silicon based approach provides excellent frequency stability and reliability. The 843241 features up, down, and center spread spectrum (SSC) clocking techniques. The up, down and center SSC will be required in the SAS-2 applications that have three clock trees in the HBA and expander ASICs (see Applications Information section, Figure 3).