The R1RW0416D is a 4-Mbit High-Speed static RAM organized 256-kword × 16-bit. It has realized highspeed access time by employing CMOS process (6-transistor memory cell) and High-Speed circuitdesigning technology. It is most appropriate for the application which requires High-Speed, high densitymemory and wide bit width configuration, such as cache and buffer memory in system. Especially, L-Versionand S-Version are low power consumption and it is the best for the battery backup system. Thepackage prepares 400-mil 44-pin SOJ and 400-mil 44-pin plastic TSOPII for high density surfacemounting.

Features

  • Single 3.3V supply: 3.3V ± 0.3V
  • Access time: 10ns / 12ns (max)
  • Completely static memory
    • No clock or timing strobe required
  • Equal access and cycle times
  • Directly TTL compatible
    • All inputs and outputs
  • Operating current: 145mA / 130mA (max)
  • TTL standby current: 40mA (max)
  • CMOS standby current: 5mA (max)            : 0.8mA (max) (L-version)            : 0.5mA (max) (S-version)
  • Data retention current: 0.4mA (max) (L-version)            :0.2mA (max) (S-version)
  • Data retention voltage: 2.0V (min) (L-version , S-version)
  • Center VCCand VSStype pin out

Product Options

Part Number PLP Part Status Pkg. Type Carrier Type Buy Sample
R1RW0416DSB-2SR#D1
2030-03-01 Active TSOP(2) Tray
Availability

Documentation & Downloads

Title Other Languages Type Format File Size Date
Datasheets & Errata
R1RW0416D Series Datasheet 日本語 Datasheet PDF 563 KB
PCNs & PDNs
Unification of a JEDEC tray and a embossed carrier tape for LQFP package (Additional Information & Correction) 日本語 Product Change Notice PDF 4.86 MB
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001B/E ) 日本語 Product Change Notice PDF 3.74 MB
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001A/E ) 日本語 Product Change Notice PDF 1.46 MB
Other
Package Drawing TSOP(2) 44pin PTSB0044GG-A Package Outline Drawing PDF 79 KB
Renesas Semiconductor Lead-Free Packages Brochure PDF 1.32 MB