Currently, the development for autonomous driving has progressed and the number of connections between the instrument cluster and various sensors, information, and control devices are increasing. This is leading to an increasing amount of information being displayed on the instrument cluster to realize, including information on the vicinity of the car during driving. At the same time, from the point of view of safety, the need for increased visibility is increasing, and it is necessary to render graphics smoothly. Also, due to advances in LCD display technology, the trends towards larger sizes, higher resolution, and lower costs in automotive LCD displays are progressing. As a result, 3D clusters are becoming more widely used in the instrument cluster field.
Renesas has released the R-Car D3e automotive system SoC to address smooth rendering of high-quality 3D graphics and reduce development steps and costs, which are challenges for the development of entry-class 3D clusters.
- Using the PowerVR Series8XE 3D graphics cores from Imagination Technologies' latest series, the R-Car D3e achieves approximately six times the rendering performance of the existing R-Car D1
- System developers creates 3D clusters using low-cost 4-layer printed circuit boards and reduce the number of parts, that enables reduced system bill of materials (BOM) costs and achieves system costs as low as current 2D cluster systems
- Renesas is working together with industry-leading partners in the instrument cluster field to provide solutions that will reduce development steps and costs
- Automotive instrument cluster