Dr. Sailesh Chittipeddi became Executive Vice President and General Manager of IoT and Infrastructure Business Unit of Renesas in July 2019. He joined Renesas in March 2019.
Before joining Renesas, he served IDT’s Executive Vice President of Global Operations and CTO, with an additional focus on corporate growth and differentiation. In this role he is responsible for the company’s operations, procurement, quality, supply chain, foundry engineering, assembly engineering, product & test engineering, facilities, Design Automation, and Information Technology groups. From a product line perspective, he has responsibility for the IoT Systems Group, RapidWave Interconnect Systems, PCIe and Standard Products Group. Additionally, Dr. Chittipeddi helps IDT leverage its existing strengths to increase corporate value while driving the rapid delivery of new products.
Prior to joining IDT, Dr. Chittipeddi was President and CEO of Conexant Systems and served on its Board of Directors. He led the company in its transition from a public company to private ownership and through its debt restructuring efforts. Before that, he held several executive roles at Conexant Systems, including COO, co-President, EVP for Operations and Chief Technical Officer, with responsibility for global engineering, product development, operations, quality, facilities, IT and associated infrastructure support. Dr. Chittipeddi started his career in technology with AT&T Bell Labs and progressively managed larger engineering and operations groups with AT&T Microelectronics/Lucent and Agere Systems. Dr. Chittipeddi serves on the Board of Directors for Avalanche Technology (USA) and Tessolve (Division of Hero Electronix, India). He also serves as a Board Observer in Blu Wireless Technology (Bristol, UK), Peraso Technologies (Canada) and Anagog (Israel).
Dr. Chittipeddi holds five degrees, including an M.B.A from the University of Texas at Austin and a Ph.D. in physics from The Ohio State University. Dr. Chittipeddi has earned 64 U.S. patents related to semiconductor process, package and design, and has had nearly 40 technical articles published.