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Complete Current Share 10A DC/DC Power Module

パッケージ情報

CADモデル: View CAD Model
Pkg. Type: Module
Pkg. Code: YGE
Lead Count (#): 23
Pkg. Dimensions (mm): 15.0 x 15.0 x 2.20
Pitch (mm): 1.1

環境及び輸出分類情報

Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free No
ECCN (US)
HTS (US)

製品スペック

Lead Count (#) 23
Carrier Type Tray
Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free No
Pb Free Category Solder Plate
Temp. Range (°C) -55 to +125°C
Configuration Normal
Control Type Voltage Mode
Current Sharing Yes
Digital Bus No
Input Voltage (Max) (V) 20
Input Voltage (Min) (V) 4.5
Length (mm) 15
MOQ 96
Output Current (Max) [Rail 1] (A) 10
Output Voltage (Max) (V) 6
Output Voltage (Min) (V) 0.6
POR Yes
Parametric Category Analog-Interface Power Modules
Peak Efficiency (%) 94
Pitch (mm) 1.1
Pkg. Dimensions (mm) 15.0 x 15.0 x 2.20
Pkg. Type Module
Pvin (Max) 20
Pvin (Min) 3
Qualification Level Standard
Quiescent Current 36 mA
SYNCH Capability Yes
Switching Frequency (KHz) 1.5 - 1.5
Switching Frequency Range (Typical) (kHz) 700 - 1500
Thickness (mm) 2.2
Width (mm) 15

説明

Support is limited to customers who have already adopted these products.

The ISL8200MMREP is a simple and easy to use high power, current-sharing DC/DC power module for Datacom/Telecom/FPGA power hungry applications. All that is needed is the ISL8200MMREP, a few passive components and one VOUT setting resistor to have a complete 10A design ready for market. The ease of use virtually eliminates the design and manufacturing risks while dramatically improving time to market. Need more output current? Just simply parallel up to six ISL8200MMREP modules to scale up to a 60A solution (see Figure 6 on page 10). The simplicity of the ISL8200MMREP is in its “Off The Shelf”, unassisted implementation. Patented current sharing in multiphase operation greatly reduces ripple currents, BOM cost and complexity. For example, parallel 2 for 20A and up to 6 for 60A. The output voltage can be precisely regulated to as low as 0. 6V with ±1% output voltage regulation over line, load, and temperature variations. The ISL8200MMREP’s thermally enhanced, compact QFN package, operates at full load and over-temperature, without requiring forced air cooling. It's so thin it can even fit on the back side of the PCB. Easy access to all pins with few external components, reduces the PCB design to a component layer and a simple ground layer.