| タイトル | 情報 |
|---|---|
| Pkg. Name Name used to describe Renesas packages. | SUBG0025LA-A |
| JEITA Standard The JEITA standard to which the device is compliant. | S-UFBGA25-2.14x2.27-0.40 |
| Package Description Descriptive text for this package. | Terminal Material - Base: Sn-Ag-Cu |
| Package Status | Active |
| Package Type | S-UFBGA |
| クラス | IC |
| Package Code The unique identifier of this package. | pkg_20045 |
| Lead Count | 25 |
| Pb (Lead) Free | Yes |
| 長さ | 2.27mm |
| 幅 | 2.14mm |
| Thickness 取り付け高さ or 本体高さ (外形図をご参照ください) | 0.53mm |
| Pitch | 0.4mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5 | 2.27 x 2.14 x 0.53 |
