Overview
Description
The Renesas RA4M3 group of 32-bit microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M33 core with TrustZone®. In concert with the secure crypto engine, it offers secure element functionality. The RA4M3 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M3 is suitable for IoT applications requiring vast communication options, future proof security, large embedded RAM, and low active power consumption down to 119µA/MHz running the CoreMark® algorithm from Flash.
Features
- 100MHz Arm Cortex-M33 with TrustZone
- Secure element functionality
- 512kB - 1MB Flash memory and 64kB SRAM with parity and 64kB SRAM with ECC
- 8kB Data Flash to store data as in EEPROM
- 1kB Stand-by SRAM
- Scalable from 64-pin to 144-pin packages
- Capacitive touch sensing unit (CTSU)
- USB 2.0 Full Speed
- CAN 2.0B
- Quad SPI
- SCI (UART, Simple SPI, Simple I2C)
- SPI/I2C multi-master interface
- SDHI and MMC
Comparison
Applications
Design & Development
Software & Tools
Sample Code
Boards & Kits
Models
ECAD Models
Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on the CAD Model links in the Product Options table. If a symbol or model isn't available, it can be requested directly from SamacSys.
Support
Support Communities
Renesas Academy
Support Communities
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RA4M3 Address space
I'm developing firmware for a r7fa4m3af3cfb mcu. I'm looking at the assembler code being generated and I find it is reading/writing to memory located at 0x4011_1xxxx. We I look in the latest user's manual - Apendix 3 - I/O Registers - there is nothing that ...
Jul 14, 2024 -
how to interface TFT Display with RA4M3 developement board using spi communication
i am new user to renesas family and e2 studio i will attach TFT display driver data sheet , i want help as quickly as possible
May 5, 2024 -
RA4M3 bootloader guide
When I tried to use bootloader according to the document on ek-ra4m3 development board, I found that the final result was not achieved. According to the document, the bootloader program was created first, then the application program was created, then the application program was set, and finally xxx bin ...
Jun 8, 2022
FAQs
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RA6M1, RA6M2, RA6M3, RA6T1, RA6M4, RA6M5, RA4M2, RA4M3: Can A/D conversion be performed on other analog input?
Yes. Temperature sensor output and internal reference voltage are selectable at the same time as the analog input of the channel. A/D conversion is performed first for the analog input of the channel, next for the temperature sensor output, and then for the internal reference voltage.
Apr 28, 2021 -
Correcting RAM Length for RA4M3 MCUs in FSP
The RAM length is incorrectly specified in the linker script for RA4M3 MCUs in FSP v2.2.0 through FSP 3.0.0. It is corrected in FSP 3.1.0. In versions before FSP 3.1.0 edit the memory_regions.ld file (or it's equivalent in other ...
Jul 6, 2021 -
Secure Key Installation limitation on RA4M2, RA4M3, RA6M4 and RA6M5 in FSP 300
Secure Key installation via the factory bootloader in FSP 3.0.0 is not supported for RSA 3K, RSA 4K, and ECC secp256k1 on the following devices:Certain EK-RA6M4 and EK-RA4M3 Evaluation Kits may contain the affected silicon. If your application requires secure key installation of RSA 3K ...
Apr 29, 2021
Videos & Training
Introduction to the RA4M3 MCU group with industry-leading performance, security and memory enhancements for low power IoT applications.
Additional Videos
Events & Webinars
News & Blog Posts
Blog Post
Jan 28, 2022
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