Package Information
| Lead Count (#) | 28 |
| Pkg. Code | pkg_860 |
| Pkg. Type | HWQFN |
| Pkg. Dimensions (mm) | 5 x 5 x 0.8 |
Environmental & Export Classifications
| ECCN (US) | 3A991 |
| RoHS (R5F21192NP#W4) | EnglishJapanese |
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| HTS (US) |
Product Attributes
| RAM (KB) | 0.5 |
| Lead Count (#) | 28 |
| Temp. Range | -20 to +85°C |
| Bit Size | 16 |
| CPU | R8C |
| Carrier Type | Tape & Reel |
| DMA | No |
| Data Flash (KB) | 2 |
| Ethernet | No |
| Family Name | R8C |
| I/O Ports | 13 |
| LVD or PVD | Yes |
| Lead Compliant | Yes |
| Length (mm) | 5 |
| MOQ | 5000 |
| Operating Freq (Max) (MHz) | 20 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 5 x 5 x 0.8 |
| Pkg. Type | HWQFN |
| Program Memory (KB) | 8 |
| RTC | No |
| Supply Voltage (V) | 2.7 - 5.5 |
| Tape & Reel | No |
| Thickness (mm) | 0.8 |
| Timer | 8-bit x 2-ch, 16-bit x 1-ch |
| Width (mm) | 5 |
Description
The R8C/19 Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.
These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/19 Group has on-chip data flash ROM (1KB × 2 blocks). The difference between the R8C/18 Group and R8C/19 Group is only the presence or absence of data flash ROM. Their peripheral functions are the same.