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256K x 18 SuperSync FIFO, 3.3V

Package Information

CAD Model:View CAD Model
Pkg. Type:TQFP
Pkg. Code:PNG64
Lead Count (#):64
Pkg. Dimensions (mm):14.0 x 14.0 x 1.4
Pitch (mm):0.8

Environmental & Export Classifications

Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)3
ECCN (US)EAR99
HTS (US)8542.32.0071

Product Attributes

Lead Count (#)64
Pb (Lead) FreeYes
Carrier TypeTray
Moisture Sensitivity Level (MSL)3
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN, USA
ArchitectureUni-directional
Bus Width (bits)18
Core Voltage (V)3.3
Density (Kb)4096
Family NameSuperSync
I/O Frequency (MHz)100 - 100
I/O Type3.3 V LVTTL
InterfaceSynchronous
Length (mm)14
MOQ45
Organization256K x 18
Package Area (mm²)196
Pb Free Categorye3 Sn
Pitch (mm)0.8
Pkg. Dimensions (mm)14.0 x 14.0 x 1.4
Pkg. TypeTQFP
Price (USD)$219.39622
PublishedNo
Qty. per Carrier (#)90
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)0 to 70°C
Thickness (mm)1.4
Width (mm)14

Description

The 72V2105 is an 256K x 18 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. SuperSync FIFOs are particularly appropriate for networking, video, telecommunications, data communications and other applications that need to buffer large amounts of data.