Lead Count (#) | 44 |
Pkg. Code | PHG44 |
Pitch (mm) | 0.8 |
Pkg. Type | TSOP |
Pkg. Dimensions (mm) | 18.41 x 10.16 x 1.0 |
Pb (Lead) Free | Yes |
Moisture Sensitivity Level (MSL) | 3 |
ECCN (US) | NLR |
HTS (US) | 8542320041 |
Lead Count (#) | 44 |
Pb (Lead) Free | Yes |
Carrier Type | Tray |
Moisture Sensitivity Level (MSL) | 3 |
Country of Assembly | Taiwan |
Country of Wafer Fabrication | Taiwan, United States |
Price (USD) | 1ku | 7.70456 |
Access Time (ns) | 15 |
Architecture | Asynchronous |
Bus Width (bits) | 8 |
Core Voltage (V) | 3.3 |
Density (Kb) | 4096 |
I/O Voltage (V) | 3.3 - 3.3 |
Length (mm) | 18.41 |
MOQ | 135 |
Organization | 512K x 8 |
Package Area (mm²) | 187.0 |
Pb Free Category | e3 Sn |
Pitch (mm) | 0.8 |
Pkg. Dimensions (mm) | 18.41 x 10.16 x 1.0 |
Pkg. Type | TSOP |
Qty. per Carrier (#) | 135 |
Qty. per Reel (#) | 0 |
Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
Tape & Reel | No |
Temp. Range | -40 to 85°C |
Thickness (mm) | 1.0 |
Width (mm) | 10.16 |