Interface

Overview

The ISL33002 two-channel bus buffer provides the buffering necessary to extend the bus capacitance beyond the 400pF maximum specified by the I2C specification. In addition, the ISL33002 features rise time accelerator circuitry to reduce power consumption from passive bus pull-up resistors and improve data-rate performance. The device also includes hot-swap circuitry to prevent corruption of the data and clock lines when I2C devices are plugged into a live backplane, and the ISL33002 adds level translation for mixed supply voltage applications. The ISL33002 operates at supply voltages from +2.3V to +5.5V at a temperature range of -40 °C to +85 °C.

ISL3300x Functional Diagram
ISL3300x Functional Diagram
  • Two-channel I2C compatible bidirectional buffer
  • +2.3VDC to +5.5VDC supply range
  • >400kHz operation
  • Bus capacitance buffering
  • Rise time accelerators
  • Hot swapping capability
  • ±6kV Class 3 HBM ESD protection on all pins
  • ±12kV HBM ESD protection on SDA/SCL pins
  • Logic level translation
  • Accelerator disable pin
  • Pb-free (RoHS compliant) 8 Ld TDFN (3mm x 3mm) and 8 Ld MSOP packages
  • Low quiescent current: 2.1mA typ
  • Low shutdown current: 0.5µA typ

Applications

  • I2C bus extender and capacitance buffering
  • Server racks for telecom, datacom and computer servers
  • Desktop computers
  • Hot-swap board insertion and bus isolation

Documentation

Type Title Date
Datasheet
ISL33001, ISL33002, ISL33003 Datasheet
PDF 1.17 MB
Brochure
Analog ICs Brochure
PDF 5.20 MB 日本語
Product Advisory
PA22010 - Datasheet specification change for listed Renesas ISL33001*, ISL33002*, ISL33003* Products
PDF 164 KB
Product Change Notice
PCN21016 - Correction of Moisture Sensitivity Level and Alternate bond wire material of the listed Renesas DFN, QFN, TDFN, TQFN packaged products
PDF 202 KB
End Of Life Notice
PLC21035 - End of Life Notice
PDF 1.17 MB
Product Change Notice
PCN20029A - Alternate bond wire material and assembly facility of the listed Renesas QFN packaged products
PDF 326 KB
Product Advisory
PA14042 - Minimum Line Quantity Change
PDF 363 KB
Product Change Notice
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal
PDF 106 KB
Product Change Notice
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump
PDF 173 KB
Product Change Notice
PCN13005 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - Carsem (CAS) Ipoh, Malaysia
PDF 84 KB
Product Change Notice
PCN11059 - Shipping Tube Change for Intersil MSOP Packaged Products
PDF 117 KB
Application Note
AN1637: Level Shifting Down to 1.8V Using 3.3V I2C Buffers
PDF 303 KB
12 items

Design & Development

Software Downloads
Type Title Date
End Of Life Notice
PLC21035 - End of Life Notice
PDF 1.17 MB
1 item

Boards & Kits

ISL3300xMSOPEVAL1Z I2C Bus Buffer Eval Board

ISL33002MSOPEVAL1Z

Evaluation
Order Now

I2C Bus Buffer with Rise Time Accelerators and Hot Swap Capability Evaluation Board

The ISL33002MSOPEVAL1Z evaluation board is designed to provide a quick and easy method for evaluating the ISL33002 two-channel bus buffer with rise time accelerators...

Featured Documents:
ISL33001MSOPEVAL1Z, ISL33002MSOPEVAL1Z, ISL33003MSOPEVAL1Z User Guide

ECAD Models

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Product Options

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    ISL33002IRT2Z
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    ISL33002IRT2Z-T
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    		TDFN Reel 6000
    ISL33002IUZ
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    ISL33002IUZ-T
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    		 MSOP Reel 2500 Get Samples,
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