Features
- Android Wired Headset v1.1 compliant
- High-performance mono microphone to ADC record path with 90dB SNR
- ADC digital filters with Audio and Voice mode high-pass characteristics
- Low noise microphone bias regulator with programmable output
- High-performance stereo DAC to headphone playback path with 100dB SNR
- DAC digital filters with Audio and Voice mode high-pass cutoff and 5-band equalizer
- Advanced Accessory Detect supports
- 3 and 4-pole jack detection
- MIC/GND polarity switching (OMTP/CTIA jack types)
- Multiple button detection
- Headphone impedance testing
- Microphone input with automatic level control
- Digital sidetone path with gain
- Digital tone generator
- System controller for simplified pop-free startup and shut-down
- Mixed sample rates of 24kHz ADC, 48kHz DAC supported from a single digital interface
- Sample rates of up to 96kHz at 24-bit resolution
- Shut-down mode for very low current consumption during standby
- Phase-locked loop with WCLK tracking to generate system clock
- 4-wire digital audio interface with support for I2S, TDM and other audio formats
- 2-wire I2C compatible interface with support for High Speed mode up to 3.4MHz
- 4.5mm x 1.6mm WLCSP RouteEasy™ package for low cost PCB manufacture
Description
The DA7219 is an ultra-low power audio codec with Advanced Accessory Detection (AAD), which supports sample rates up to 96kHz at 24-bit resolution. It contains a mono microphone to Analog-to-Digital Converter (ADC) path and a stereo Digital-to-Analog Converter (DAC) to headphone (HP) path. AAD supports the detection and identification of 3-pole (headphone) and 4-pole (headset) jacks and allows the automatic pin order switching of MIC/GND on CTIA or OMTP headsets. It also supports automatic multiple button detection.
Benefits
- GND/MIC polarity switch and multiple button detection for CTIA/OMTP audio jacks
- 7.5mm2 package footprint enabling PCB space savings in area constrained applications
- Capless headphone driver eliminates large AC coupling capacitors
- Optimized ball-out conducive for low cost PCB manufacturing
Advanced Accessory Detection (AAD)

The AAD will detect a jack insertion/removal, detect the polarity of the jack (CTIA/OMTP), and will support the detection of impedance based buttons in parallel with the connected accessory microphone.
Parameters
| Attributes | Value |
|---|---|
| ADC SNR A-weighted support(dB) @ 48kHz | 90 @ 1.8V |
| DAC SNR A-weighted support(dB) @ 48kHz | 100 @ 1.8V |
| Power Consumption During Record | 2.75mW @ 1.8V |
| Power Consumption During Playback | 3.4mW @ 1.8V |
| Headphone Power Output | 2 x 70mW @ 2.5V |
| Audio Interface | 2-wire |
| Advanced Features | Advanced Accessory detection, polarity switching |
Package Options
| Pkg. Type | Pkg. Dimensions (mm) | Pitch (mm) |
|---|---|---|
| 32-WLCSP | 4.5 x 1.6 | 0.5 |
Application Block Diagrams
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Additional Applications
- Chromebooks
- Portable audio applications
- Tablets and eReaders
- Headphone accessories
- Remote controllers
- Gaming controllers
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| Part Number | Status | Samples | Stock | Package | Budgetary Price (USD) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Country of Assembly | Country of Wafer Fabrication |
|---|---|---|---|---|---|---|---|---|---|---|
| DA7219-02VBA | Active | N/A | In Stock | 32-WLCSP | 1ku | $1.05 | Tape & Reel | 1 | Yes | TAIWAN | TAIWAN |
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Filters
Applied Filters
- Application NotePDF 2.12 MB Jan 12, 2022AI-generated Summary: The DA7219 ball-out is updated to add a dedicated ground ball for the headphone return (GND_HP), separating it from the sensitive analogue ground to reduce noise interference. This change involves repurposing the VDD_DIG ball and repositioning seven balls for optimal layout. The schematic and PCB layout are modified accordingly, resulting in improved performance with minimal impact on design complexity. The update eliminates one capacitor and enhances headset support by isolating ground returns for OMTP and CTIA types. PCB design files typically include BOM, schematic, and Gerber files reflecting these changes.
Recommended Documents (1)
Datasheets (1)
Manuals & Guides (1)
- Application NotePDF 2.12 MB Jan 12, 2022AI-generated Summary: The DA7219 ball-out is updated to add a dedicated ground ball for the headphone return (GND_HP), separating it from the sensitive analogue ground to reduce noise interference. This change involves repurposing the VDD_DIG ball and repositioning seven balls for optimal layout. The schematic and PCB layout are modified accordingly, resulting in improved performance with minimal impact on design complexity. The update eliminates one capacitor and enhances headset support by isolating ground returns for OMTP and CTIA types. PCB design files typically include BOM, schematic, and Gerber files reflecting these changes.
Application Notes & White Papers (1)
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Renesas Boards & Kits
Audio Codec with Advanced Accessory Detect Evaluation Kit
The DA7219-EVAL evaluation board has been designed to allow measurement and functional testing of the DA7219 ultra-low power audio codec with advanced accessory detect.
All analog and digital audio functionalities are contained within the DA7219 evaluation board (EVB) as well as the control... Read More