DA14705 builds off the successes of Renesas’ SmartBond™ line, with Arm Cortex®-M33F at 160 MHz as integrated application processors, 2D graphics processor, Voice Activity Detector (VAD) and Power Management Unit (PMU). With its ultra-low-power radio transceiver offering +6 dBm output power, and -97 dBm sensitivity combined with its software-configurable and upgradeable protocol engine (MAC), the DA14705 is capable of supporting Bluetooth® low energy as well as multiple other 2.4GHz protocols. These unique features make the DA14705 the first product in the wireless SoC space to offer this level of integration.
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Application Note
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Application Note
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Certificate
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Certificate
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Device Errata
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Guide
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Guide
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Guide
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Manual - Development Tools
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Manual - Software
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Materials Composition Declaration
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Product Advisory
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Product Brief
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Product Change Notice
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Release Note
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Release Note
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SmartBond™ Development ToolsSmartSnippets™ Studio is a royalty-free software development platform for SmartBond™ devices. | Software Package | Renesas |
The DA1470x Development Kit Pro is ideal for software developers who want total control over their software development and want to keep an eye on the power consumption...
Renesas offers a production test and programming unit that enables you to reduce the time to ramp-up at a lower cost. The Production Line Tool (PLT) helps to increase...
Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on products in the Product Options table. If a symbol or model isn't available, it can be requested directly from the website.
See how the DA1470x family of integrated Bluetooth® Low Energy MCUs enables voice control and machine learning on the edge.