Lead Count (#) | 20 |
Pkg. Type | TQFN |
Pitch (mm) | 0.4 |
Pkg. Dimensions (mm) | 2.0 x 3.0 |
Pb (Lead) Free | Yes |
ECCN (US) | EAR99 |
HTS (US) | 8542.39.90 |
Moisture Sensitivity Level (MSL) | 1 |
Pkg. Type | TQFN |
Lead Count (#) | 20 |
Carrier Type | Tape & Reel |
Pb (Lead) Free | Yes |
Temp. Range | -40 to +105°C |
Country of Assembly | China, Taiwan |
Country of Wafer Fabrication | Taiwan |
# of Programable Delays (#) | 1 |
ACMP Channels (#) | 4 |
Additional Features | Supported in Go Configure™ Software Hub |
CNT/DLY (Max) (#) | 8 |
DFF (Max) (#) | 17 |
GPIOs (#) | 17 |
Interface | I2C |
Look-up Table (LUTs) | 19 |
Memory Type | MTP |
Moisture Sensitivity Level (MSL) | 1 |
Nominal VDD | 2.3-5.5 |
Oscillator Type | RC OSC, LF OSC, Ring OSC |
Pattern Generator | 1 |
Pipe Delay | 16-stage |
Pitch (mm) | 0.4 |
Pkg. Dimensions (mm) | 2.0 x 3.0 |
Qty. per Reel (#) | 3000 |
Temperature Sensor (ch) (#) | 1 |
VDD2 (V) | 1.71 - 5.5 |
The SLG46826-E programmable mixed-signal matrix IC with extended temperature range provides a small, low-power component for commonly used mixed-signal functions. The user creates their circuit design by programming the multiple-time programmable non-volatile memory (NVM) to configure the interconnect logic, the IO pins, and the macrocells of the SLG46826-E. A dual power supply allows the device to flexibly interface two independent voltage domains. This highly versatile device allows for a wide variety of mixed-signal functions to be designed within a very small, low-power single integrated circuit.