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Overview

Description

The Renesas RA4M3 group of 32-bit microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M33 core with TrustZone®. In concert with the secure crypto engine, it offers secure element functionality. The RA4M3 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M3 is suitable for IoT applications requiring vast communication options, future proof security, large embedded RAM, and low active power consumption down to 119µA/MHz running the CoreMark® algorithm from Flash.

Features

  • 100MHz Arm Cortex-M33 with TrustZone
  • Secure element functionality
  • 512kB - 1MB Flash memory and 64kB SRAM with parity and 64kB SRAM with ECC
  • 8kB Data Flash to store data as in EEPROM
  • 1kB Stand-by SRAM
  • Scalable from 64-pin to 144-pin packages
  • Capacitive touch sensing unit (CTSU)
  • USB 2.0 Full Speed
  • CAN 2.0B
  • Quad SPI
  • SCI (UART, Simple SPI, Simple I2C)
  • SPI/I2C multi-master interface
  • SDHI and MMC

Comparison

Applications

Documentation

Design & Development

Software & Tools

Sample Code

Boards & Kits

Models

ECAD Models

Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on the CAD Model links in the Product Options table. If a symbol or model isn't available, it can be requested directly from SamacSys.

Diagram of ECAD Models

Models

Type Title Date
Model - IBIS ZIP 2.44 MB
Model - BSDL Log in to Download ZIP 64 KB
2 items

Product Options

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Support

Support Communities

Support Communities

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Browse FAQs

FAQs

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Support Communities

  1. RA4M3 interrupt priority default is 12

    I see for the RA4M3, which is an ARM Cortex-M33 that the default interrupt priority is set to 12. Any special reason for that default value?  Often I see 0 or 1 so just curious the motivation?

    Jan 6, 2022
  2. RA4M3 bootloader guide

    When I tried to use bootloader according to the document on ek-ra4m3 development board, I found that the final result was not achieved. According to the document, the bootloader program was created first, then the application program was created, then the application program was set, and finally xxx bin ...

    Jun 8, 2022
  3. RA4M3 Block Configuration of the Data Flash

    hello,  Currently I'm programming some functions to erase, write and read the data flash memory. I'm take as base the example flash_hp_ek_ra3m3, I have a question regarding to block Configuration of the Data Flash in the application note for flash RA FAMILY : In the manual ...

    May 29, 2025
View All Results from Support Communities (112)

FAQs

  1. Secure Key Installation limitation on RA4M2, RA4M3, RA6M4 and RA6M5 in FSP 300

    Secure Key installation via the factory bootloader in FSP 3.0.0 is not supported for RSA 3K, RSA 4K, and ECC secp256k1 on the following devices:Certain EK-RA6M4 and EK-RA4M3 Evaluation Kits may contain the affected silicon. If your application requires secure key installation of RSA 3K ...

    Apr 29, 2021
  2. RA6M1, RA6M2, RA6M3, RA6T1, RA6M4, RA6M5, RA4M2, RA4M3: Can A/D conversion be performed on other analog input?

    Yes. Temperature sensor output and internal reference voltage are selectable at the same time as the analog input of the channel. A/D conversion is performed first for the analog input of the channel, next for the temperature sensor output, and then for the internal reference voltage.

    Apr 28, 2021
  3. RA4M2, RA4M3, RA6M4, RA6M5: Is it possible to change the Trustzone boundaries via OTA?

    ... change the IDAU settings in firmware and it is not possible to be manipulated during remote update (e.g. OTA). So the answer is no, the Trustzone boundaries cannot be changed during OTA.   Resources: Securing Data at Rest Using the Arm® TrustZone®   Suitable Products RA4M2,RA4M3,RA6M4,RA6M5

    Oct 30, 2024
View All Results from FAQs (135)

Videos & Training

Introduction to the RA4M3 MCU group with industry-leading performance, security and memory enhancements for low power IoT applications.