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IO-Link Device Transceiver with Cost-Optimized Feature Set

Package Information

Pitch (mm) 0.5
Pkg. Type DFN10
Pkg. Dimensions (mm) 3.0 x 3.0 x 0.75

Environmental & Export Classifications

Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free Yes
ECCN (US) EAR99
HTS (US) 8542.39.90

Product Attributes

Carrier Type Tape & Reel
Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free Yes
Temp. Range -40 to +125°C
Country of Assembly Taiwan
Country of Wafer Fabrication Malaysia
Advanced Features 3.3V and 5V LDO options, Embedded reverse polarity and overcurrent protection, Automatic recovery
Channels (#) 1
MOQ 5000
Pitch (mm) 0.5
Pkg. Dimensions (mm) 3.0 x 3.0 x 0.75
Pkg. Type DFN10
Qty. per Reel (#) 5000
Supply Voltage (V) 7 - 36

Description

The CCE4503 is an easy-to-use device-side IO-Link compliant transceiver. It combines IO-Link compliant communication capability with advanced protection circuitry and additional features while keeping the application small and simple.

Controlled by a UART interface (TXD, RXD, TXEN), the output drivers can be configured as PNP, NPN or Push-Pull. Three LDO options and an automatic wake-up detection simplify the overall system requirements and reduce the need for additional external circuitry. The integrated protection features such as reverse-polarity protection, overcurrent protection, undervoltage detection, and thermal protection ensure robust functionality and communication.

With the small 3mm x 3mm DFN10 package size, it is especially suitable for space-limited sensor and actuator applications.

The CCE4503 IO-Link Device Transceiver is suitable for IO-Link device applications and is compliant with the IO-Link interface and system specification Version 1.1.2 from July 2013, accessible via www.io-link.org.

For a complete end-to-end system solution, Renesas also provides the CCE4510 two-channel IO-Link Master Transceiver.

Benefits

  • All IO-Link frame types supported
  • Optimized feature set for best in market cost-efficiency
  • Improved protection features
  • Low power dissipation
  • Minimal need for external circuitry
  • Especially suitable for space-constricted applications