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Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | WLCSP |
| Pkg. Code: | |
| Lead Count (#): | 64 |
| Pkg. Dimensions (mm): | 2.90x3.42 |
| Pitch (mm): |
Environmental & Export Classifications
| RoHS (DA14870-10D00GH2) | EnglishJapanese |
| Pb (Lead) Free | |
| Moisture Sensitivity Level (MSL) | |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Software Support | ADP - NNP&PYOUR |
| Lead Count (#) | 64 |
| Pkg. Dimensions (mm) | 2.90x3.42 |
| Carrier Type | Reel |
| Temp. Range (°C) | -30 to +85°C |
| Device Functions | Single chip |
| I/O Type | GPIOs, SPIs, UARTs, I2Cs, I3C, USB2.0, DAIs, PDMs, 6 ch ADC |
| Memory External | Yes |
| Pkg. Type | WLCSP |
| Power Amplifier | 12 |
| Processor CPU MIPS (MIPS) | 160 |
| Processor DSP MIPS (MIPS) | 320 |
Resources for DA14870
Description
The DA14870 Bluetooth® dual-mode audio IC, combined with Renesas Smart Codecs and system PMICs, forms a flexible, low-power chipset for high-performance portable Bluetooth audio products. It features an Arm® Cortex®-M33F processor, Tensilica® Fusion F1 audio DSP, Bluetooth SIG v6.0 qualified core layers, and a rich set of peripherals and communication interfaces, including USB 2.0 HS/FS. A dedicated low-power Edge AI Neural Network Processor (NNP) supports advanced features such as voice activity detection (VAD), hot-word detection (HWD), acoustic event detection (e.g., glass breaking), and audio scene detection (e.g., music), enabling contextual awareness.
The DA14870 development kit, including the Customer Development Kit (CDK) hardware and Audio Development Platform (ADP) software and tools, provides a flexible platform to accelerate Bluetooth audio product deployment and reduce time to market.