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R-Car M3

Overview

Ideal for medium-class automotive computing systems

Medium-class vehicles that are popular globally are equipped with in-vehicle computers in a variety of forms, combinations of which are used to build systems suitable for a given region or grade of vehicle. Compared to the previously released R-Car H3, the functionality and capabilities of the R-Car M3 have been optimized so that it can be used for a wide variety of purposes. Automotive manufacturers and part manufacturers can use the R-Car M3 in a wide variety of automotive computing devices according to their requirements. The R-Car M3 is fully software-compatible with the R-Car H3, so existing software resources can be used effectively.
The R-Car M3 is available as a standalone chip and also as a system-in-package (SiP) module already mounted with DDR memory. The difficulty of designing a connection is increasing due to faster connection speeds between an SoC and DDR memory, or an increasing number of connection signals. The R-Car M3 SiP module offered by Renesas helps alleviate this design burden.

Features

  1. Compliant with ISO 26262 (ASIL-B) functionality safety standard for automotive
  2. Optimized functions and performance enables use in a wide range of applications
  3. Availability of SIP modules with external memory to reduce the design workload
  4. Compatibility with previous products enables use of existing ecosystem and access to over 180 R-Car Consortium partners

Offers optimal solutions matched to ever-evolving technologies

System Block Diagram

R-Car M3

Specifications

ItemR-Car M3 Specifications
Product name (part number)R-Car M3 (R8J77960 (SiP), R8A77960 (SoC))
Power supply voltage3.3/1.8 V (IO), 1.1 V (LPDDR4), 0.9 V (core)
CPU coreArm® Cortex®-A57
Dual
Arm® Cortex®-A53
Quad

Arm® Cortex®-R7
Dual Lock-Step

Cache memoryL1 Instruction cache:48 KB
L1 Operand cache:32 KB
L2 cache:1 MB
L1 Instruction cache:32 KB
L1 Operand cache:32 KB
L2 cache:512 KB
L1 Instruction cache:32 KB
L1 Operand cache:32 KB
External memory
  • LPDDR4-SDRAM
  • Maximum operating frequency: 1600 MHz
  • Data bus width: 32 bits x 2 ch (12.8GB/s x 2)
3D Graphics
  • Imagination Technologies’ PowerVR® Series 6XT GX6250
Video
  • Display Out x 3 ch
  • Video Input x 8 ch
  • Video codec module (H.265, H.264/AVC, MPEG-4, VC-1, etc.)
  • IP conversion module
  • Up and down scaling, 1-D LUT/3D-LUT/1D-Histogram/2D-Histgram, color conversion, super resolution, rotate, ordered dithering, sharpness, lossless compression/decompression, lossy compression
  • TS Interface x 2 ch
  • Stream and security processor
  • Distortion compensation module x 4 ch (IMR-LX4)
  • High performance real-time image recognition engine (IMP-X5)
Audio
  • Audio DSP
  • Sampling rate converter × 10 ch
  • Serial sound interface × 10 ch
Storage interfaces
  • USB 3.0 host interface (DRD) × 1 port (wPHY)
  • USB 2.0 host interface × 1 port (wPHY)
    USB 2.0 host/function/OTG interface × 1 port (wPHY)
  • SD host interface × 4 ch (SDR104)
  • Multimedia card interface × 2 ch
  • PCI Express 2.0 (1 lane) x 2 ch
In car network and
automotive peripherals
  • Media local bus (MLB) interface × 1 ch (3-pin interface)
  • Controller area network (CAN-FD support) interface × 2ch
  • Ethernet AVB 1.0-compatible MAC built in
    Interface: RGMII
    Ethernet AVB (802.1BA)
    ・IEEE802.1BA
    ・IEEE802.1AS
    ・IEEE802.1Qav
    ・IEEE1722
Security
  • Crypto engine (AES, DES, Hash, RSA) x 2 ch
  • SystemRAM
Other peripherals
  • SYS-DMAC x 48 ch, Realtime-DMAC x 16 ch,
    Audio-DMAC x 32 ch, Audio(peripheral)-DMAC x 58 ch
  • 32bit timer x 41 ch
  • PWM timer × 7 ch
  • I2C bus interface × 8 ch
  • Serial communication interface (SCIF) × 11 ch
  • SPI multi I/O bus controller (RPC) × 1 ch (HyperFlashTM/QSPI support)
  • Clock-synchronized serial interface (MSIOF) × 4 ch (SPI/IIS)
  • Digital radio interface (DRIF) × 4 ch
Low power mode
  • Dynamic Power Shutdown
  • AVS(Adaptive Voltage Scaling), DVFS(Dynamic Voltage and Frequency Scaling), DDR-SDRAM power supply backup mode
Package1255-pin SiP module (40 mm x 40 mm, 0.8 mm pitch)
1022- pin Flip chip BGA (29 mm x 29 mm, 0.8 mm pitch)
Development
environment
ICE for Arm CPU available from tool vendors
Evaluation boardA user system development reference platform with the following features is also available to enable the users to carry out efficient system development.
(1) Incorporates car information system-oriented peripheral circuits, providing users with an actual device verification environment.
(2) Can be used as a software development tool for application software, etc.
(3) Allows easy implementation of custom user functions.
Software Platform
  • Support OS: Linux, AndroidTM, QNX® Neutrino® RTOS, Integrity® etc.
  • OpenGL ES3.1 3D graphics library, Wide variety of H.265, H.264, MPEG-4 and VC-1 for video compliant with OpenMAX IL I/F in addition to BSPs compliant with OSs standard API are available to realize complete system concept..

(Remarks)
・Arm and Cortex are registered trademarks of Arm Limited.
・PowerVR is a trademark of Imagination Technologies Limited.
・Android is a registered trademark from Google Inc.
・QNX, neutrino and Blackberry are trademarks from BlackBerry Limited, and are used with permission from QNX Software System Limited.
・Green Hills Software and INTEGRITY are trademarks or registered trademarks of Green Hills Software, Inc. in the U.S. and/or internationally.
・HyperFlash is a trademark of Spansion LLC in the United States and other countries.
・All names of other products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.

 

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