The 74ALVC162334 is a 16-bit universal bus driver that has series resistors in the device output structure which will significantly reduce line noise when used with light loads. This driver has been designed to drive ±12mA at the designated threshold levels. The 74ALVC162334 operates at -40C to +85C

特長

  • Typical tSK(o) (Output Skew) < 250ps
  • ESD > 2000V per MIL-STD-883, Method 3015
  • > 200V using
  • machine model (C = 200pF, R = 0)
  • VCC = 3.3V ± 0.3V, Normal Range
  • VCC = 2.7V to 3.6V, Extended Range
  • VCC = 2.5V ± 0.2V
  • CMOS power levels (0.4 uW typ. static)
  • Rail-to-Rail output swing for increased noise margin
  • Balanced Output Drivers: ±12mA
  • Available in 48 pin TSSOP package

製品選択

発注型名 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type 購入/サンプル
74ALVC162334PAG
Package Info
Env. Documentation
 Active TSSOP 48 C はい Tube
Availability

購入/見積
74ALVC162334PAG8
Package Info
Env. Documentation
 Active TSSOP 48 C はい Reel
Availability
購入/見積

ドキュメント＆ダウンロード

タイトル 他の言語 分類 形式 サイズ 日付
データシート
74ALVC162334 Datasheet – データシート PDF 141 KB
アプリケーションノート、ホワイトペーパー
AN-224: ALVC/LVC Logic Characteristics and Apps. – アプリケーションノート PDF 238 KB
PCN / PDN
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly – 製品変更通知 PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly – 製品変更通知 PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location – 製品変更通知 PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location – 製品変更通知 PDF 544 KB
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages – 製品変更通知 PDF 333 KB
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages – 製品変更通知 PDF 291 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w – 製品変更通知 PDF 24 KB
PCN# : A0803-02 Add ATP as alternate assembly for TSSOP-48 and TSSOP-56 – 製品変更通知 PDF 129 KB
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP – 製品変更通知 PDF 147 KB
PCN#: TB-0510-05 New Shipping Tube for TSSOP/TVSOP/TSSOP Exposed – 製品変更通知 PDF 201 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green – 製品変更通知 PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph – 製品変更通知 PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph – 製品変更通知 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph – 製品変更通知 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT – 製品変更通知 PDF 35 KB
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products – 製品変更通知 PDF 80 KB
PCN#: A-0405-06, To qualify alternate facility ATP for PV (SSOP) – 製品変更通知 PDF 22 KB
PCN#:A-0312-01, new mold compound material - G600 – 製品変更通知 PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 – 製品変更通知 PDF 116 KB
PCN#: A-0310-01, Green Products – 製品変更通知 PDF 26 KB
PDN# L-03-04: Product Discontinuance – 製品中止通知 PDF 105 KB
PCN#: G-0303-04, new m/c G700 & 8290 d/a material – 製品変更通知 PDF 130 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer – 製品変更通知 PDF 110 KB
PCN# G-0110-06 REV.1 Mold Compound – 製品変更通知 PDF 48 KB
PCN# G-0203-05 Mold Compound – 製品変更通知 PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 – 製品変更通知 PDF 27 KB
PCN# G-0110-06 Mold Compound – 製品変更通知 PDF 47 KB
PCN# L0110-04 Moisture Level Change From 1 to 3 – 製品変更通知 PDF 32 KB
PCN# G0106-01, Moisture Sensitive Label Change – 製品変更通知 PDF 274 KB
PCN# G9911-05, To qualify low alpha mold compound. – 製品変更通知 PDF 44 KB
ダウンロード
74ALVC162334 Hspice Model – モデル－HSPICE ZIP 49 KB
74ALVC162334 IBIS Model – モデル－IBIS ZIP 10 KB
info: For device-specific or order-specific documentation, submit a support request.