The 74ALVC162244 16-bit buffer/driver is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. The 74ALVC162244 has series resistors in the device output structure which will significantly reduce line noise when used with light loads. The 74ALVC162244 operates at -40C to +85C

特長

  • Typical tSK(o) (Output Skew)
  • ESD > 2000V per MIL-STD-883, Method 3015
  • > 200V using machine model (C = 200pF, R = 0)

製品選択

発注型名 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type 購入/サンプル
74ALVC162244PAG
Package Info
Env. Documentation
 Active TSSOP 48 C はい Tube
Availability

購入/見積
74ALVC162244PAG8
Package Info
Env. Documentation
 Active TSSOP 48 C はい Reel
Availability
購入/見積

ドキュメント＆ダウンロード

タイトル 他の言語 分類 形式 サイズ 日付
データシート
74ALVC162244 Datasheet – データシート PDF 155 KB
アプリケーションノート、ホワイトペーパー
AN-224: ALVC/LVC Logic Characteristics and Apps. – アプリケーションノート PDF 238 KB
PCN / PDN
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly – 製品変更通知 PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly – 製品変更通知 PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location – 製品変更通知 PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location – 製品変更通知 PDF 544 KB
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages – 製品変更通知 PDF 333 KB
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages – 製品変更通知 PDF 291 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w – 製品変更通知 PDF 24 KB
PCN# : A0803-02 Add ATP as alternate assembly for TSSOP-48 and TSSOP-56 – 製品変更通知 PDF 129 KB
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP – 製品変更通知 PDF 147 KB
PCN#: TB-0510-05 New Shipping Tube for TSSOP/TVSOP/TSSOP Exposed – 製品変更通知 PDF 201 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green – 製品変更通知 PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph – 製品変更通知 PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph – 製品変更通知 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph – 製品変更通知 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT – 製品変更通知 PDF 35 KB
PDN# L-05-04 Selective Logic Products Obsolescence – 製品中止通知 PDF 173 KB
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products – 製品変更通知 PDF 80 KB
PCN#: A-0405-06, To qualify alternate facility ATP for PV (SSOP) – 製品変更通知 PDF 22 KB
PCN#:A-0312-01, new mold compound material - G600 – 製品変更通知 PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 – 製品変更通知 PDF 116 KB
PCN#: A-0310-01, Green Products – 製品変更通知 PDF 26 KB
PCN#: G-0303-04, new m/c G700 & 8290 d/a material – 製品変更通知 PDF 130 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer – 製品変更通知 PDF 110 KB
PCN# G-0110-06 REV.1 Mold Compound – 製品変更通知 PDF 48 KB
PCN# G-0203-05 Mold Compound – 製品変更通知 PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 – 製品変更通知 PDF 27 KB
PCN# G-0110-06 Mold Compound – 製品変更通知 PDF 47 KB
PCN# L0110-04 Moisture Level Change From 1 to 3 – 製品変更通知 PDF 32 KB
PCN# G0106-01, Moisture Sensitive Label Change – 製品変更通知 PDF 274 KB
PCN# G9911-05, To qualify low alpha mold compound. – 製品変更通知 PDF 44 KB
ダウンロード
74ALVC162244 Hspice Model – モデル－HSPICE ZIP 48 KB
74ALVC162244 IBIS Model – モデル－IBIS ZIP 10 KB
info: For device-specific or order-specific documentation, submit a support request.