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Enter a package code or lead count to find documentation (package outline drawings, PCNs, etc.) and specifications:

Package Resources

Package Thermal Data

Download: Thermal Data (XLS)

The management of thermal energy due to a microelectronic device’s power dissipation is important to receive the best possible performance out of any electronic product.  The temperature at which a microelectronic device operates determines among other things the speed and reliability of the product. IDT actively enhances its products and packages to generate the fastest and most reliable devices possible. However, since product performance is often affected by its implementation, careful consideration of the factors affecting the device’s operating temperature is recommended to achieve the best possible results.

The most important factors affecting device operating temperature are power dissipation, air temperature, package construction, and cooling mechanisms.  The combination of these factors determine at what temperature the product will operate.  The current method for determining the operating temperature is to use the following equations:

  • QJA = (TJ - TA)/P
  • QJC = (TJ - TC)/P
  • QCA = (TC - TA)/P
  • QJA = QJC + QCA
  • TJ = TA + P [QJA]
  • TC = TA + P [QCA]

QJA = Package thermal resistance from the die to the ambient air (degree Celsius per watt)
QJC = Package thermal resistance from the die to the package case (degree Celsius per watt)
QCA = Package thermal resistance from the package case to the ambient air (degree Celsius per watt)
TJ = Average die temperature (degree Celsius)
TC = Package case temperature (degree Celsius)
TA = Ambient air temperature (degree Celsius)
P = Power (watts)

These equations are the current models which determine package temperatures.  More precise and complex models are sometimes used in the industry, but these require more information regarding the mounting conditions and cooling mechanisms of the part.  Due to the difficulty in compiling this information, these simple models are generally used to give a comparison of thermal performance of a part in varying packages and an estimate of the operating temperature.

Green / RoHS

The IDT Green Initiative

The proactive IDT Green initiative is comprehensive, effective, and sets the mark for the entire semiconductor industry. This program encompasses packaging, processing and all aspects of our business operations. IDT launched the Green package program in 2000 and now virtually all products are: fully Green, beyond RoHS compliance, and comply with or surpass the most comprehensive worldwide environmental safe-product rules.

The use of Lead (Pb) in electronic products is of increasing environmental concern and in 1999 the U.S. EPA announced a drastic reduction of lead compounds. In 2003 the European Union established a phase-out date (July 1, 2006) for Lead (Pb) in electronic products with few exceptions. IDT began lead reduction efforts in 2000 and has expanded it to encompass a comprehensive Green program to meet and exceed customer and legislative requirements.

We believe it is globally essential for the semiconductor industry to provide environmentally safe components for electronics systems. Our strategy is to develop programs that ensure the production of environmentally friendly products. IDT has developed and qualified Green parts throughout our product portfolio. We continue to support customers who require non-Green products and work closely with our customers to ensure a seamless conversion to Green products.

All Lead-free orders will be filled with Green products. Volume production quantities of Green products are available and can be ordered by their respective Green part number.


Lead-Free Definition:

  • Lead (Pb) < 1000 ppm

RoHS Definition:

  • Mercury (Hg) < 1000 ppm
  • Hexavalent Chromium (Cr+6) < 1000 ppm
  • Cadmium (Cd) < 100 ppm
  • PBB < 1000 ppm
  • PBDE < 1000 ppm

Green Leadframe Products:

  • Terminals are plated with 100% matte Tin over Copper, which is annealed at 150°C for 1 hour within 24 hours after plating.
  • In addition to being RoHS compliant, IDT Green products have the following package material limits:
    • Bromine (Br) < 900 ppm
    • Chlorine (Cl) < 900 ppm
    • Antimony (Sb) < 750 ppm (same as Antimony Trioxide (Sb2O3) < 900 ppm)
    • Red Phosphorous (P4) < 100 ppm

Green BGA Products:

  • Solder balls are SnAgCu
  • In additional to being RoHS compliant, IDT Green products have the following package material limits:
    • Bromine (Br) < 900 ppm
    • Chlorine (Cl) < 900 ppm
    • Antimony( Sb) < 750 ppm (same as Antimony Trioxide(Sb2O3) < 900 ppm)

Green Flip Chip Products:

  • Solder bumps are SnAg. Solder balls are SnAgCu.
  • In addition to being RoHS compliant, IDT Flip Chip products have the following package material limits:
    • Bromine (Br) < 900 ppm
    • Chlorine (Cl) < 900 ppm
    • Antimony( Sb) < 750 ppm (same as Antimony Trioxide(Sb2O3) < 900 ppm)
    • Red Phosphorous(P4) < 100 ppm


  • RoHS 6 or RoHS 6/6 compliance is complying with the restriction of all 6 RoHS listed substances, without taking any exemptions.  Red, Yellow, Inorganic Phosphorous (P4) are "not intentionally added".
  • RoHS 5 or RoHS 5/6 compliance refers to RoHS compliance and taking Pb exemptions. In other words, RoHS 5 compliant parts contain Pb > 1000 ppm, but meet the concentration limits for Hg, Cr6+, Cd, PBB and PBDE.
  • Antimony and Bromine concentration limit is applicable to polymeric materials only such as mold compound

Green / RoHS FAQ

See our Green/RoHS frequently asked questions (FAQ).