The 74FCT162500T 18-bit high-speed, low-power registered transceivers combine D-type latches and D-type flip-flops to allow data flow in transparent, latched and clocked modes. The 74FCT162500T offers low ground bounce, minimal undershoot, and controlled output fall times–reducing the need for external series terminating resistors. The 74FCT162500T operates at -40C to +85C

特長

  • A and C speeds
  • High-speed, low-power CMOS
  • Typical tSK(o) (Output Skew) < 250ps
  • Low input and output leakage ?1 uA (max.)
  • ESD > 2000V per MIL-STD-883, Method 3015
  • > 200V using machine model (C = 200pF, R = 0)
  • VCC = 5V ±10%
  • Balanced Output Drivers (±24mA)
  • Reduced system switching noise
  • Typical VOLP (Output Ground Bounce) < 0.6V at VCC = 5V, TA = 25C
  • Available in 56 pin SSOP package

製品選択

製品名 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type 購入/サンプル
74FCT162500ATPVG
Package Info
PCB Symbol, Footprint, and 3D Model
Obsolete SSOP 56 C はい Tube
Availability
購入/見積
74FCT162500ATPVG8
Package Info
PCB Symbol, Footprint, and 3D Model
Obsolete SSOP 56 C はい Reel
Availability
購入/見積
74FCT162500CTPVG
Package Info
PCB Symbol, Footprint, and 3D Model
Obsolete SSOP 56 C はい Tube
Availability
購入/見積
74FCT162500CTPVG8
Package Info
PCB Symbol, Footprint, and 3D Model
Obsolete SSOP 56 C はい Reel
Availability
購入/見積

ドキュメント＆ダウンロード

タイトル language 分類 形式 サイズ 日付
データシート
74FCT162500T Datasheet – データシート PDF 135 KB
アプリケーションノート、ホワイトペーパー
AN-230 I/O Interface Standards – アプリケーションノート PDF 160 KB
AN-154: Estimating Power Dissipation in CMOS – アプリケーションノート PDF 80 KB
AN-123: ESD Considerations in High Speed Circuits – アプリケーションノート PDF 125 KB
AN-116: Decoupling Double Density Components – アプリケーションノート PDF 96 KB
AN-147: The Myth of Ground Bounce Measurements – アプリケーションノート PDF 130 KB
AN-146: FCT-T Double-Density Logic Characteristics – アプリケーションノート PDF 173 KB
PCN / PDN
PCN# : A1504-04 Assembly Transfer from Amkor Philippines to OSE Taiwan – 製品変更通知 PDF 484 KB
PDN# : CQ-15-01 (R1) Quarter PDN for Declined Market – 製品中止通知 PDF 550 KB
PDN# : CQ-15-01 Quarter PDN for Declined Market – 製品中止通知 PDF 547 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w – 製品変更通知 PDF 24 KB
PCN#: TB-0510-05 New Shipping Tube for TSSOP/TVSOP/TSSOP Exposed – 製品変更通知 PDF 201 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green – 製品変更通知 PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph – 製品変更通知 PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph – 製品変更通知 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph – 製品変更通知 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT – 製品変更通知 PDF 35 KB
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products – 製品変更通知 PDF 80 KB
PCN # A-0406-07Rev.1, Qualify OSE-Taiwan for SSOP & TSSOP – 製品変更通知 PDF 21 KB
PCN#:A-0309-06 Rev1, Hermetic transfer to ATP-P1 – 製品変更通知 PDF 44 KB
PCN # L0203-09R2 Addendum Fab Transfer from Fab 2 to Fab 4 – 製品変更通知 PDF 101 KB
PCN#: A-0405-06, To qualify alternate facility ATP for PV (SSOP) – 製品変更通知 PDF 22 KB
PCN#:A-0312-01, new mold compound material - G600 – 製品変更通知 PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 – 製品変更通知 PDF 116 KB
PCN#: A-0310-01, Green Products – 製品変更通知 PDF 26 KB
PDN# L-03-04: Product Discontinuance – 製品中止通知 PDF 105 KB
PCN# L0203-09R1 Tech Upgrade & Fab Transfer – 製品変更通知 PDF 98 KB
PCN# G-0110-06 REV.1 Mold Compound – 製品変更通知 PDF 48 KB
PCN# G-0203-05 Mold Compound – 製品変更通知 PDF 40 KB
PCN# G-0110-06 Mold Compound – 製品変更通知 PDF 47 KB
PCN# L0110-04 Moisture Level Change From 1 to 3 – 製品変更通知 PDF 32 KB
PDN# Logic-00-14: Obsolete Military Grade Options – 製品抹消通知 PDF 25 KB
PDN# Logic-00-08: Obsolete selective speed grades – 製品抹消通知 PDF 28 KB
PCN# G9911-05, To qualify low alpha mold compound. – 製品変更通知 PDF 44 KB
ダウンロード
74FCT162500T Hspice Model – モデル－HSPICE ZIP 28 KB
74FCT162500T IBIS Model – モデル－IBIS ZIP 9 KB
info: For device-specific or order-specific documentation, submit a support request.