Package Information
| Lead Count (#) | 100 |
| Pkg. Code | pkg_9396 |
| Pkg. Type | LFQFP |
| Pkg. Dimensions (mm) | 14 x 14 x 1.7 |
Environmental & Export Classifications
| ECCN (US) | 3A991 |
| HTS (US) | 9999.99.9999 |
| RoHS (R5F2L3A8CDFP#31) | EnglishJapanese |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
Product Attributes
| RAM (KB) | 8 |
| Lead Count (#) | 100 |
| Temp. Range | -40 to +85°C |
| Country of Assembly | China |
| Country of Wafer Fabrication | Japan |
| Price (USD) | 1ku | 7.17378 |
| ADC | 8-bit x 20-ch, 10-bit x 20-ch |
| Bit Size | 16 |
| CPU | R8C |
| Carrier Type | Tray |
| DAC | 8-bit x 2-ch |
| DMA | No |
| Data Flash (KB) | 4 |
| Ethernet | No |
| Family Name | R8C |
| Human Machine Interface | LCD Segment Count x 416 |
| I/O Ports | 88 |
| LVD or PVD | Yes |
| Lead Compliant | Yes |
| Length (mm) | 14 |
| MOQ | 1 |
| Moisture Sensitivity Level (MSL) | 3 |
| Operating Freq (Max) (MHz) | 20 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 14 x 14 x 1.7 |
| Pkg. Type | LFQFP |
| Program Memory (KB) | 64 |
| RTC | Yes |
| Replacement Remark | PLP P/N Change from R5F2L3A8CDFP#30 to R5F2L3A8CDFP#31 |
| Supply Voltage (V) | 1.8 - 5.5 |
| Tape & Reel | No |
| Thickness (mm) | 1.7 |
| Timer | 8-bit x 3-ch, 16-bit x 4-ch |
| Width (mm) | 14 |
Description
The R8C/L3AC Group is supported only for customers who have already adopted these products. The RL78/L1C Group is recommended for new designs.
The R8C/L35M Group, R8C/L36M Group, R8C/L38M Group, and R8C/L3AM Group of single-chip MCUs incorporate the R8C CPU core, which implements a powerful instruction set for a high level of efficiency and supports a 1Mb address space, allowing execution of instructions at high speed. In addition, the CPU core integrates a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, helps reduce the number of system components. These groups have data flash (1KB × 4 blocks) with the background operation (BGO) function.