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2kx8 CMOS PROM

Package Information

Lead Count (#) 24
Pkg. Type SBDIP
Pkg. Code HVR
Pitch (mm) 2.54
Pkg. Dimensions (mm) 30.48 x 15.11 x 2.41

Environmental & Export Classifications

Moisture Sensitivity Level (MSL) Not Applicable
Pb (Lead) Free No
ECCN (US) EAR99
HTS (US)

Product Attributes

Pkg. Type SBDIP
Lead Count (#) 24
Carrier Type Tube
Moisture Sensitivity Level (MSL) Not Applicable
Pb (Lead) Free No
Pb Free Category Hot Solder Dip
MOQ 45
Temp. Range -55 to +125°C
CAGE code 34371
Die Sale Availability? No
Flow Harsh Environment & MIL-STD-883
Length (mm) 30.5
PROTO Availability? No
Pitch (mm) 2.5
Pkg. Dimensions (mm) 30.5 x 15.1 x 2.41
Qualification Level Class Q
Rating MIL-STD-883
Thickness (mm) 2.41
Width (mm) 15.1

Description

The HM-6617/883 is a 16, 384-bit fuse link CMOS PROM in a 2K word by 8-bit/word format with "Three-State" outputs. This PROM is available in the standard 0. 600 inch wide 24 pin SBDIP, the 0. 300 inch wide slim SBDIP, and the JEDEC standard 32 pad CLCC. The HM-6617/883 utilizes a synchronous design technique. This includes on-chip address latches and a separate output enable control which makes this device ideal for applications utilizing recent generation microprocessors. This design technique, combined with the Renesas advanced self-aligned silicon gate CMOS process technology offers ultra-low standby current. Low ICCSB is ideal for battery applications or other systems with low power requirements. The Renesas NiCr fuse link technology is utilized on this and other Renesas CMOS PROMs. This gives the user a PROM with permanent, stable storage characteristics over the full industrial and military temperature voltage ranges. NiCr fuse technology combined with the low power characteristics of CMOS provides an excellent alternative to standard bipolar PROMs or NMOS EPROMs. All bits are manufactured storing a logical "0" and can be selectively programmed for a logical "1" at any bit location.